Inventor · disambiguated record
Yong In Lee
Also filed as: LEE YONG I · LEE YONG IN
16 granted patents·9 pending applications·121 citations·filing 1995–2024
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9SHINWHA INTERTEK CORP5EOM JUN PHILL2KIM BYUNG SOO2KIM JONG-SUN2
Top patents by PatentIndex Score
25 records- 0190US9273845B2Lighting deviceEOM JUN PHILL·Filed 2012·Granted Mar 1, 2016·18 cites·18 claims
- 0288US11061591B2Storage device processing stream data, system including the same, and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·6 cites·19 claims
- 0381US11635902B2Storage device processing stream data, system including the same, and operation methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·1 cites·19 claims
- 0481US10004138B2Touch panel and manufacturing method thereofLG INNOTEK CO LTD·Filed 2014·Granted Jun 19, 2018·4 cites·12 claims
- 0581US6235385B1Electrically conductive adhesive tapeSHIN WHA PRODUCTS CO LTD·Filed 1999·Granted May 22, 2001·53 cites·3 claims
- 0680US7001538B2PTC composition and PTC device comprising the sameSHINWHA INTERTEK CORP·Filed 2002·Granted Feb 21, 2006·16 cites·12 claims
- 0779US9121981B2Light unitKIM JONG SUN·Filed 2011·Granted Sep 1, 2015·3 cites·14 claims
- 0874US6828362B1PTC composition and PTC device comprising itSHINWHA INTERTEK CORP·Filed 2000·Granted Dec 7, 2004·12 cites·20 claims
- 0970US8956962B2Method for fabricating large-area nanoscale patternLEE YOUNG-JAE·Filed 2011·Granted Feb 17, 2015·3 cites·8 claims
- 1067US9983229B2Test socket for testing semiconductor chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 29, 2018·1 cites·19 claims
- 1160US12411760B2Memory device and method with compute express link for degradationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·29 claims
- 1258US9759408B2Illuminating member for reducing unified glare rating and lighting device using the sameEOM JUN PHILL·Filed 2012·Granted Sep 12, 2017·1 cites·15 claims
- 1355US2024205169A1Method and electronic apparatus with parallel single-stage switchingSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1455US2025199973A1Networking switch and method with direct memory access based link controlSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US2023115922A1Method for monitoring substrate, method for fabricating semiconductor device using the same, and substrate process system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1653US2025077407A1Electronic device and method with memory operation mode controlSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1751US2005260908A1Electroconductive adhesive tapeSHINWHA INTERTEK CORP·Filed 2003·Application pending·0 cites
- 1851US2006199004A1Electroconductive adhesive tapeSHINWHA INTERTEK CORP·Filed 2006·Application pending·0 cites
- 1947US2002142157A1Electroconductive adhesive tapeSHINWHA INTERTEK CORP·Filed 2001·Application pending·0 cites
- 2046US9832861B2Touch panel and manufacturing method thereofKIM BYUNG SOO·Filed 2010·Granted Nov 28, 2017·0 cites·23 claims
- 2146US2013255766A1Conductive paste compositions and solar cells using the sameSHIN JUNG-HWAN·Filed 2013·Application pending·0 cites
- 2242US9625642B2Light unitKIM JONG SUN·Filed 2011·Granted Apr 18, 2017·0 cites·17 claims
- 2341US9400577B2Capactive touch panelKIM BYUNG SOO·Filed 2010·Granted Jul 26, 2016·0 cites·9 claims
- 2438US2017031633A1Method of operating object-oriented data storage device and method of operating system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2531US5545471AElectroconductive adhesive tapeFiled 1995·Granted Aug 13, 1996·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →