Inventor · disambiguated record
Young-Gue Lee
Also filed as: LEE YOUNG-GUE
3 granted patents·5 pending applications·84 citations·filing 2006–2014
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0192US7528474B2Stacked semiconductor package assembly having hollowed substrateSTATS CHIPPAC LTD·Filed 2006·Granted May 5, 2009·70 cites·15 claims
- 0280US7964952B2Stacked semiconductor package assembly having hollowed substrateSTATS CHIPPAC LTD·Filed 2009·Granted Jun 21, 2011·11 cites·16 claims
- 0355US8866280B2Chip packageCHOI SOO-MIN·Filed 2009·Granted Oct 21, 2014·3 cites·7 claims
- 0445US2014346654A1Chip packageADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 0540US2008128890A1Chip package and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0634US2008237821A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0734US2008197468A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0834US2008237820A1Package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →