Inventor · disambiguated record
Yoonsoo Lee
Also filed as: LEE YOONSOO
3 granted patents·3 pending applications·2 citations·filing 2017–2024
57Inventor score
Top patents by PatentIndex Score
6 records- 0178US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0277US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
- 0371US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
- 0467US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
- 0552US2024162117A1Power electronics package with dual-single side cooling water jacketSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 0637US2023343322A1Provision of voice information by using printout on which attribute information of document is recordedHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →