Inventor · disambiguated record
Youngkwan Lee
Also filed as: LEE YOUNGKWAN
4 granted patents·2 pending applications·7 citations·filing 2019–2023
65Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0185US11031328B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·4 cites·17 claims
- 0274US11239148B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 1, 2022·2 cites·16 claims
- 0364US11469148B2Semiconductor package having a redistribution layer for package-on-package structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 11, 2022·1 cites·18 claims
- 0463US11626362B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0553US2023341776A1Resist compound and method of forming pattern using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0643US2020219833A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →