Inventor · disambiguated record
Yong Koon Lee
Also filed as: LEE YONG KOON
12 granted patents·3 pending applications·34 citations·filing 2016–2023
86Inventor score
Top patents by PatentIndex Score
15 records- 0196US11676907B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·4 cites·20 claims
- 0293US9991219B2Fan-out semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 5, 2018·17 cites·19 claims
- 0389US10763217B2Semiconductor package and antenna module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·6 cites·21 claims
- 0484US10340245B2Fan-out semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 2, 2019·4 cites·20 claims
- 0578US12148708B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 0673US11062999B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 0768US10192844B2Fan-out semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 29, 2019·1 cites·8 claims
- 0863US9899331B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 20, 2018·1 cites·17 claims
- 0957US11670623B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·22 claims
- 1046US11037880B2Semiconductor package and antenna module including the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 1146US10903548B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·18 claims
- 1246US10896884B2Semiconductor package and antenna module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·16 claims
- 1340US2019378775A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1439US2019122994A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 1534US2017287825A1Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →