Inventor · disambiguated record
Yongkoon Lee
Also filed as: LEE YONGKOON
12 granted patents·16 pending applications·11 citations·filing 2019–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD28
Top patents by PatentIndex Score
28 records- 0193US11935849B2Semiconductor package with an antenna substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·2 cites·20 claims
- 0291US11735553B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·2 cites·20 claims
- 0390US11562939B2Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·20 claims
- 0490US11527495B2Semiconductor package with an antenna substrateSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 13, 2022·2 cites·20 claims
- 0580US11569563B2Semiconductor packages and method of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0677US2025046737A1Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0776US12183694B2Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0876US11329014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·2 cites·16 claims
- 0975US12040248B2Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1075US2024347409A1Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1172US12040299B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1272US2025273637A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1368US11637079B2Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·19 claims
- 1465US12327826B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 1564US11935847B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·18 claims
- 1662US2025192019A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1761US2025062240A1Semiconductor package with improved structural stabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1860US2025273577A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1960US2025192013A1Wiring substrate and semiconductor package including a substrate wiring patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025192018A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025006696A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2255US2024063070A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2354US2024222280A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2454US2024014197A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2554US2024421034A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2654US2024021531A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2753US2023148143A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2849US2024055338A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →