Inventor · disambiguated record
Yongkwan Lee
Also filed as: LEE YONGKWAN
24 granted patents·16 pending applications·8 citations·filing 2013–2025
91Inventor score
Top patents by PatentIndex Score
40 records- 0185US11101243B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0280US11538801B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·1 cites·20 claims
- 0376US10008488B2Semiconductor module adapted to be inserted into connector of external deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·3 cites·19 claims
- 0470US12087650B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0570US2024347401A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0668US12132007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 0767US11469156B2Semiconductor package for discharging heat generated by semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·13 claims
- 0866US2023343560A1Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0965US12438134B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1065US11742329B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1165US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1264US2025210494A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1363US12456660B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·17 claims
- 1462US12463126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 1562US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1662US11581266B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 1761US2025118689A1Semiconductor package having a controllerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1860US12288743B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 1960US2025218800A1Semiconductor device, semiconductor package, and printed circuit board having a patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2059US12057357B2Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recessesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·18 claims
- 2158US12494439B2Semiconductor packages having fixing membersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 2258US11688656B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·15 claims
- 2358US2025046663A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2458US2025079232A1Semiconductor package bonding tool and semiconductor package fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2557US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 2657US2025014963A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2757US2025191986A1Semiconductor packages including molding guide patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2856US10978374B2Semiconductor package for discharging heat generated by semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·7 claims
- 2956US2024420972A1Semiconductor molding apparatus and compression molding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3055US11728142B2Apparatus for conducting plasma surface treatment, board treatment system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 3155US11508713B2Methods of manufacturing semiconductor package and package-on-packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 3255US9894745B2Antenna structure and plasma generating deviceSEMES CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·2 claims
- 3354US12400970B2Semiconductor package including electromagnetic shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 3454US2024096748A1Chip protection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3553US11742294B2Interposers and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3653US2025210382A1Jig for dispensing an underfilling materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3753US2024079342A1Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3852US2024128190A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3951US11710673B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4039US2013178016A1Methods of fabricating a package-on-package device and package-on-package devices fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →