Inventor · disambiguated record
Yongtaek Lee
Also filed as: LEE YONGTAEK
15 granted patents·5 pending applications·39 citations·filing 2008–2024
89Inventor score
Files withLEE YONGTAEK5SAMSUNG ELECTRONICS CO LTD5STATS CHIPPAC PTE LTD5STATS CHIPPAC LTD4SHEKHAWAT SAMPAT1
Top patents by PatentIndex Score
20 records- 0188US8183130B2Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structureLEE YONGTAEK·Filed 2010·Granted May 22, 2012·14 cites·20 claims
- 0281US8349648B2Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrateSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·6 cites·20 claims
- 0377US8942019B2Current vector controlled deadtime for multilevel invertersSHEKHAWAT SAMPAT·Filed 2011·Granted Jan 27, 2015·7 cites·20 claims
- 0473US8269308B2Semiconductor device with cross-talk isolation using M-cap and method thereofLEE YONGTAEK·Filed 2008·Granted Sep 18, 2012·6 cites·24 claims
- 0570US12032990B2Electronic device which prefetches application and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 9, 2024·1 cites·18 claims
- 0668US9190340B2Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor packageLEE YONGTAEK·Filed 2011·Granted Nov 17, 2015·3 cites·30 claims
- 0761US12482755B2Semiconductor device and method of making an interconnect bridge with integrated passive devicesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Nov 25, 2025·0 cites·21 claims
- 0861US9704857B2Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrateSTATS CHIPPAC LTD·Filed 2012·Granted Jul 11, 2017·1 cites·23 claims
- 0961US9640603B2Semiconductor device and method of forming inductor over insulating material filled trench in substrateSTATS CHIPPAC LTD·Filed 2014·Granted May 2, 2017·1 cites·19 claims
- 1060US2024371720A1Semiconductor package and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1159US12229407B2Electronic device comprising heterogeneous memories and method for transferring compression data between heterogeneous memories thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 1253US2024047386A1Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor WaferSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 1352US12287983B2Data swapping method and electronic device supporting sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1452US2025266362A1Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive DevicesSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1551US10903304B2Semiconductor device and method of forming inductor over insulating material filled trench in substrateSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jan 26, 2021·0 cites·22 claims
- 1649US9082638B2Semiconductor device with cross-talk isolation using M-capLEE YONGTAEK·Filed 2012·Granted Jul 14, 2015·0 cites·20 claims
- 1749US2010327406A1Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In SubstrateSTATS CHIPPAC LTD·Filed 2009·Application pending·0 cites
- 1848US11237741B2Electronic device and control method for controlling memorySAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·15 claims
- 1948US8896115B2Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structureLEE YONGTAEK·Filed 2012·Granted Nov 25, 2014·0 cites·25 claims
- 2042US2024211137A1Electronic device for managing memory and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →