Inventor · disambiguated record
Yongxuan Liang
Also filed as: LIANG YONGXUAN · LIANG YONGXUAN EDWARD
11 granted patents·2 pending applications·29 citations·filing 2016–2025
86Inventor score
Top patents by PatentIndex Score
13 records- 0192US11860308B1Chip packaging in light detection and ranging (LIDAR) sensor systemAURORA OPERATIONS INC·Filed 2022·Granted Jan 2, 2024·4 cites·21 claims
- 0285US10833775B1Techniques for magnetic shielding of an optical isolator to maintain nominal magnetic flux density and a transmitter or transceiver system implementing sameAPPLIED OPTOELECTRONICS INC·Filed 2019·Granted Nov 10, 2020·4 cites·16 claims
- 0385US10313024B1Transmitter optical subassembly with trace routing to provide electrical isolation between power and RF tracesAPPLIED OPTOELECTRONICS INC·Filed 2018·Granted Jun 4, 2019·5 cites·17 claims
- 0484US10044445B2Techniques for reducing electrical interconnection losses between a transmitter optical subassembly (TOSA) and associated driver circuitry and an optical transceiver system using the sameAPPLIED OPTOELECTRONICS INC·Filed 2016·Granted Aug 7, 2018·5 cites·11 claims
- 0580US9923635B2Optical transmitter or transceiver including reversed planar lightwave circuit (PLC) splitter for optical multiplexingAPPLIED OPTOELECTRONICS INC·Filed 2016·Granted Mar 20, 2018·4 cites·20 claims
- 0679US12332380B2Chip packaging in light detection and ranging (LIDAR) sensor systemAURORA OPERATIONS INC·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0779US10951005B2Techniques for attachment and alignment of optical components on a thermoelectric cooler (TEC) and an optical subassembly implementing sameAPPLIED OPTOELECTRONICS INC·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 0879US2025291034A1Chip Packaging in Light Detection and Ranging (LIDAR) Sensor SystemAURORA OPERATIONS INC·Filed 2025·Application pending·0 cites
- 0974US9866329B2Optical transmitter or transceiver including transmitter optical subassembly (TOSA) modules directly aligned to optical multiplexer inputsAPPLIED OPTOELECTRONICS INC·Filed 2016·Granted Jan 9, 2018·3 cites·26 claims
- 1070US2025284008A1Systems and methods of lidar sensor systems having integrated semiconductor devicesAURORA OPERATIONS INC·Filed 2025·Application pending·0 cites
- 1167US12352868B1Systems and methods of LIDAR sensor systems having integrated semiconductor devicesAURORA OPERATIONS INC·Filed 2023·Granted Jul 8, 2025·0 cites·19 claims
- 1266US10073229B2Transmitter optical subassembly (TOSA) module with integrated welding member for use in optical transmitters or transceiversAPPLIED OPTOELECTRONICS INC·Filed 2016·Granted Sep 11, 2018·1 cites·20 claims
- 1348US10295765B2TO-Can photodiode package with integrated coupling member and exposed active region, and a receiver optical subassembly (ROSA) using the sameAPPLIED OPTOELECTRONICS INC·Filed 2017·Granted May 21, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →