Inventor · disambiguated record
Youngwoo Lim
Also filed as: LIM YOUNGWOO
2 granted patents·1 pending application·0 citations·filing 2021–2025
24Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0173US2025379176A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0261US12424582B2Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0343US12230575B2Carrier structure including pockets for accommodating semiconductor chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →