Inventor · disambiguated record
Yong Lin
Also filed as: LIN YONG · Lin yong-jie
10 granted patents·3 pending applications·19 citations·filing 2013–2019
84Inventor score
Top patents by PatentIndex Score
13 records- 0188US9865527B1Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulationTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 9, 2018·5 cites·20 claims
- 0286US9524926B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·4 cites·3 claims
- 0384US9780017B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·3 cites·20 claims
- 0478US10354890B2Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulationTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 16, 2019·2 cites·20 claims
- 0577US9054092B2Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishesTEXAS INSTRUMENTS INC·Filed 2013·Granted Jun 9, 2015·5 cites·12 claims
- 0662US10636679B2Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulationTEXAS INSTRUMENTS INC·Filed 2019·Granted Apr 28, 2020·0 cites·28 claims
- 0753US10347508B2Printed adhesion deposition to mitigate integrated circuit delaminationTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 9, 2019·0 cites·13 claims
- 0850US10727085B2Printed adhesion deposition to mitigate integrated circuit package delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 28, 2020·0 cites·17 claims
- 0950US9780060B2Packaged IC with solderable sidewallsTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·0 cites·12 claims
- 1049US2017365575A1Packaged IC With Solderable SidewallsTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 1146US2018166369A1Bi-Layer Nanoparticle Adhesion FilmTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 1245US2019262799A1Mg-doped ALUMINA AEROGEL AND MANUFACTURING METHOD THEREOFUNIV CHUNG YUAN CHRISTIAN·Filed 2018·Application pending·0 cites
- 1340US10147672B2Lead frame surface modifications for high voltage isolationTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 4, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →