Inventor · disambiguated record
Yonglong Liu
Also filed as: LIU YONGLONG
1 granted patent·2 pending applications·0 citations·filing 2022–2024
3Inventor score
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3 records- 0150US2025309018A1Encapsulated semiconductor packages including multifunctional interface material (mim) structuresSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0244US2025015040A1Annular structure for an electronic flame off wandWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0341US12114435B2Surface mount technology method and magnetic carrier systemSANDISK TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →