Inventor · disambiguated record
Yongmei Liu
Also filed as: LIU YONGMEI
6 granted patents·4 pending applications·16 citations·filing 2001–2025
74Inventor score
Files withINTEL CORP6CHINA ELECTRIC POWER RES INSTITUTE COMPANY LIMITED1SHI SONG-HUA1UNIV CAPITAL NORMAL1
Top patents by PatentIndex Score
10 records- 0171US7042729B2Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2003·Granted May 9, 2006·13 cites·23 claims
- 0259US7317258B2Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2006·Granted Jan 8, 2008·2 cites·8 claims
- 0351US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 0448US2008005886A1Thermal interface apparatus, systems, and fabrication methodsINTEL CORP·Filed 2007·Application pending·0 cites
- 0547US2025225771A1Image processing method, apparatus thereof, computer device and storage mediumUNIV CAPITAL NORMAL·Filed 2025·Application pending·0 cites
- 0646US11791237B2Microelectronic assemblies including a thermal interface materialINTEL CORP·Filed 2018·Granted Oct 17, 2023·0 cites·13 claims
- 0744US6907415B2Finding rules and exceptions from databasesFiled 2001·Granted Jun 14, 2005·1 cites·9 claims
- 0834US2006068521A1Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the methodSHI SONG-HUA·Filed 2004·Application pending·0 cites
- 0932US10826292B2Multi-time-scale digital/analog hybrid simulation system and method for power distribution network and storage mediumCHINA ELECTRIC POWER RES INSTITUTE COMPANY LIMITED·Filed 2017·Granted Nov 3, 2020·0 cites·10 claims
- 1032US2017176173A1Measuring surface layer thicknessINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →