Inventor · disambiguated record
Yoshihiro Machida
Also filed as: MACHIDA YOSHIHIRO
85 granted patents·20 pending applications·351 citations·filing 1982–2024
99Inventor score
Files withSHINKO ELECTRIC IND CO72MACHIDA YOSHIHIRO9MAXELL LTD7HITACHI JOHNSON CONTROLS AIR CONDITIONING INC3DAINIPPON SCREEN MFG2
Top patents by PatentIndex Score
105 records- 0199US9818681B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 14, 2017·127 cites·9 claims
- 0296US11892239B2Loop-type heat pipe including an evaporator, first and second condensers, a liquid pipe connecting the evaporator to the first and second condensers, and first and second vapor pipes connecting the evaporator to the first and second condensersSHINKO ELECTRIC IND CO·Filed 2021·Granted Feb 6, 2024·3 cites·7 claims
- 0395US10352626B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 16, 2019·6 cites·14 claims
- 0494US11802740B2Loop heat pipe with reinforcing memberSHINKO ELECTRIC IND CO·Filed 2021·Granted Oct 31, 2023·2 cites·11 claims
- 0592US9489985B2Multimedia player displaying operation panel depending on contentsMACHIDA YOSHIHIRO·Filed 2012·Granted Nov 8, 2016·9 cites·12 claims
- 0691US11592240B2Loop-type heat pipe with vapor moving path in liquid pipeSHINKO ELECTRIC IND CO·Filed 2020·Granted Feb 28, 2023·2 cites·11 claims
- 0791US10704838B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 7, 2020·8 cites·10 claims
- 0890US8330277B2Semiconductor element built-in deviceMACHIDA YOSHIHIRO·Filed 2010·Granted Dec 11, 2012·13 cites·8 claims
- 0990US7893524B2Wiring substrate and semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 22, 2011·19 cites·10 claims
- 1089US7624501B2Method of manufacturing multilayer wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Dec 1, 2009·18 cites·6 claims
- 1188US10408546B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Sep 10, 2019·5 cites·12 claims
- 1288US7994431B2Substrate with built-in electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 9, 2011·15 cites·8 claims
- 1387US8170394B2Multimedia player displaying operation panel depending on contentsMACHIDA YOSHIHIRO·Filed 2006·Granted May 1, 2012·12 cites·9 claims
- 1487US7312536B2Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 25, 2007·15 cites·5 claims
- 1586US10859319B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Dec 8, 2020·2 cites·9 claims
- 1686US10524388B2Loop heat pipe and electronic deviceSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 31, 2019·2 cites·10 claims
- 1786US2025133259A1Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2024·Application pending·0 cites
- 1884US12219202B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2024·Granted Feb 4, 2025·0 cites·18 claims
- 1984US10809012B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Oct 20, 2020·3 cites·6 claims
- 2084US7521283B2Manufacturing method of chip integrated substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 21, 2009·12 cites·10 claims
- 2183US9564421B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 7, 2017·4 cites·7 claims
- 2283US7772091B2Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regionsSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 10, 2010·11 cites·5 claims
- 2382US11974008B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 2481US11384993B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Jul 12, 2022·1 cites·14 claims
- 2581US8222747B2Multilayer wiring substrate mounted with electronic component and method for manufacturing the sameMACHIDA YOSHIHIRO·Filed 2011·Granted Jul 17, 2012·4 cites·7 claims
- 2680US11974007B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2023·Granted Apr 30, 2024·0 cites·21 claims
- 2780US11924502B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2023·Granted Mar 5, 2024·0 cites·22 claims
- 2880US11060798B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Jul 13, 2021·1 cites·9 claims
- 2980US7882627B2Method of manufacturing a multilayer wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 8, 2011·7 cites·4 claims
- 3079US11131509B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Sep 28, 2021·1 cites·19 claims
- 3179US10976111B2Loop type heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Apr 13, 2021·1 cites·10 claims
- 3278US10845128B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Nov 24, 2020·1 cites·6 claims
- 3377US11812091B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 3476US9743129B2Multimedia player displaying operation panel depending on contentsHITACHI MAXELL·Filed 2016·Granted Aug 22, 2017·1 cites·8 claims
- 3574US7660514B2Video recorder and method for reserve-recording a broadcast programHITACHI LTD·Filed 2005·Granted Feb 9, 2010·4 cites·17 claims
- 3671US11098958B2Loop-type heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 3771US10859321B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 8, 2020·1 cites·11 claims
- 3870US11060797B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Jul 13, 2021·1 cites·10 claims
- 3970US7936061B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted May 3, 2011·4 cites·4 claims
- 4069US11402158B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Aug 2, 2022·1 cites·9 claims
- 4169US11262137B2Loop-type heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Mar 1, 2022·1 cites·8 claims
- 4269US4437759AContact printerDAINIPPON SCREEN MFG·Filed 1982·Granted Mar 20, 1984·12 cites·11 claims
- 4368US11333443B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 4467US12050063B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2022·Granted Jul 30, 2024·0 cites·1 claims
- 4567US9048331B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 2, 2015·2 cites·10 claims
- 4667US8096049B2Method of manufacturing a multilayer wiring boardKOYAMA TETSUYA·Filed 2010·Granted Jan 17, 2012·2 cites·7 claims
- 4766US7923367B2Multilayer wiring substrate mounted with electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 12, 2011·2 cites·9 claims
- 4865US11507155B2Heat pipe with support postSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 22, 2022·0 cites·5 claims
- 4965US11118843B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2020·Granted Sep 14, 2021·0 cites·5 claims
- 5064US11470379B2Multimedia player displaying operation panel depending on contentsMAXELL LTD·Filed 2017·Granted Oct 11, 2022·0 cites·16 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →