Inventor · disambiguated record
Yoshinobu Maeno
Also filed as: MAENO YOSHINOBU
1 granted patent·3 pending applications·33 citations·filing 1998–2016
45Inventor score
Files withFUJITSU LTD4
Top patents by PatentIndex Score
4 records- 0159US6222738B1Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereofFUJITSU LTD·Filed 1998·Granted Apr 24, 2001·33 cites·6 claims
- 0248US2010101848A1Substrate unit, information processor and method of manufacturing substrate unitFUJITSU LTD·Filed 2009·Application pending·0 cites
- 0331US2008205009A1Electronic apparatus and mounting methodFUJITSU LTD·Filed 2007·Application pending·0 cites
- 0427US2016254241A1Printed circuit board and soldering methodFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →