Inventor · disambiguated record
Yosimasa Miyajima
Also filed as: MIYAJIMA YOSIMASA
5 granted patents·2 pending applications·17 citations·filing 2003–2011
79Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0181US7963308B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2006·Granted Jun 21, 2011·5 cites·23 claims
- 0279US8268113B2Apparatus and method for fabricating bonded substrateMURAMOTO TAKANORI·Filed 2011·Granted Sep 18, 2012·4 cites·4 claims
- 0376US7597774B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Oct 6, 2009·3 cites·4 claims
- 0471US7704348B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Apr 27, 2010·2 cites·1 claims
- 0556US7137427B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2003·Granted Nov 21, 2006·3 cites·9 claims
- 0651US2011011541A1Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2010·Application pending·0 cites
- 0750US2010230030A1Apparatus and method for fabricating bonded substrateFUJITSU LTD KAWASAKI JAPAN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →