Inventor · disambiguated record
Yoshimasa Miyajima
Also filed as: MIYAJIMA YOSHIMASA
9 granted patents·3 pending applications·50 citations·filing 2001–2010
87Inventor score
Technology areasG02F
Top patents by PatentIndex Score
12 records- 0185US7819165B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Oct 26, 2010·6 cites·4 claims
- 0284US7096911B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2001·Granted Aug 29, 2006·20 cites·49 claims
- 0377US7681522B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Mar 23, 2010·3 cites·17 claims
- 0473US7621310B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Nov 24, 2009·2 cites·9 claims
- 0573US7300532B2Method for manufacturing bonded substrateFUJITSU LTD·Filed 2005·Granted Nov 27, 2007·2 cites·13 claims
- 0670US7354494B2Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2004·Granted Apr 8, 2008·17 cites·27 claims
- 0753US7513966B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Apr 7, 2009·0 cites·13 claims
- 0852US8128768B2Apparatus for manufacturing bonded substrateHASHIZUME KOJI·Filed 2010·Granted Mar 6, 2012·0 cites·5 claims
- 0952US7703494B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Apr 27, 2010·0 cites·3 claims
- 1043US2006005920A1Method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1136US2003226633A1Method and apparatus for fabricating bonded substrateFUJITSU LTD·Filed 2003·Application pending·0 cites
- 1235US2006157192A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →