Inventor · disambiguated record
Yoichi Miyasaka
Also filed as: MIYASAKA YOICHI
59 granted patents·13 pending applications·1,270 citations·filing 1983–2022
98Inventor score
Top patents by PatentIndex Score
72 records- 0199US4456850APiezoelectric composite thin film resonatorNIPPON ELECTRIC CO·Filed 1983·Granted Jun 26, 1984·288 cites·20 claims
- 0296US5122923AThin-film capacitors and process for manufacturing the sameNEC CORP·Filed 1990·Granted Jun 16, 1992·165 cites·18 claims
- 0396US5053917AThin film capacitor and manufacturing method thereofNEC CORP·Filed 1990·Granted Oct 1, 1991·172 cites·25 claims
- 0495US11028536B2Defibrated material manufacturing device, and sheet manufacturing apparatusSEIKO EPSON CORP·Filed 2020·Granted Jun 8, 2021·6 cites·8 claims
- 0595US6225133B1Method of manufacturing thin film capacitorNEC CORP·Filed 1994·Granted May 1, 2001·138 cites·8 claims
- 0693US8124190B2Method for discharging liquid material, method for manufacturing color filter, and method for manufacturing organic EL elementMIYASAKA YOICHI·Filed 2008·Granted Feb 28, 2012·24 cites·9 claims
- 0793US7381449B2Method for coating material, method of manufacturing color filter substrate, method of manufacturing electroluminescence display device, method of manufacturing plasma display device, and ejection deviceSEIKO EPSON CORP·Filed 2005·Granted Jun 3, 2008·17 cites·4 claims
- 0893US5084438AElectronic device substrate using silicon semiconductor substrateNEC CORP·Filed 1989·Granted Jan 28, 1992·102 cites·10 claims
- 0990US11059294B2Liquid absorber, liquid absorbing unit, and liquid ejection apparatusSEIKO EPSON CORP·Filed 2020·Granted Jul 13, 2021·2 cites·4 claims
- 1089US11052660B2Liquid absorber and liquid ejection apparatusSEIKO EPSON CORP·Filed 2020·Granted Jul 6, 2021·2 cites·10 claims
- 1189US6225656B1Ferroelectric integrated circuit with protective layer incorporating oxygen and method for fabricating sameSYMETRIX CORP·Filed 1998·Granted May 1, 2001·74 cites·46 claims
- 1285US11319674B2Fibrous body manufacturing apparatus and fibrous body manufacturing methodSEIKO EPSON CORP·Filed 2020·Granted May 3, 2022·1 cites·8 claims
- 1385US9738996B2Sheet manufacturing apparatusSEIKO EPSON CORP·Filed 2015·Granted Aug 22, 2017·2 cites·6 claims
- 1483US7399051B2Ejection device, material coating method, method of manufacturing color filter substrate, method of manufacturing electroluminescence display device, and method of manufacturing plasma display deviceSEIKO EPSON CORP·Filed 2005·Granted Jul 15, 2008·7 cites·5 claims
- 1581US10676867B2Defibrated material manufacturing device, and sheet manufacturing apparatusSEIKO EPSON CORP·Filed 2018·Granted Jun 9, 2020·1 cites·12 claims
- 1679US6165802AMethod of fabricating ferroelectric integrated circuit using oxygen to inhibit and repair hydrogen degradationSYMETRIX CORP·Filed 1998·Granted Dec 26, 2000·53 cites·13 claims
- 1772US7601219B2Apparatus for ejecting liquid droplet, work to be applied thereto, method of manufacturing electro-optic device, electro-optic device, and electronic equipmentSEIKO EPSON CORP·Filed 2005·Granted Oct 13, 2009·5 cites·2 claims
- 1870US10920347B2Sheet manufactured from recyclable materialsSEIKO EPSON CORP·Filed 2018·Granted Feb 16, 2021·0 cites·5 claims
- 1969US7566636B2Method of scribing stuck mother substrate and method of dividing stuck mother substrateSEIKO EPSON CORP·Filed 2007·Granted Jul 28, 2009·3 cites·8 claims
- 2069US6512256B1Integrated circuit having self-aligned hydrogen barrier layer and method for fabricating sameSYMETRIX CORP·Filed 1998·Granted Jan 28, 2003·27 cites·10 claims
- 2168US11072179B2Liquid absorbent body, liquid absorber, and liquid treatment apparatusSEIKO EPSON CORP·Filed 2020·Granted Jul 27, 2021·0 cites·7 claims
- 2268US5539613ACompact semiconductor device including a thin film capacitor of high reliabilityNEC CORP·Filed 1993·Granted Jul 23, 1996·27 cites·13 claims
- 2367US10041199B2Sheet manufacturing apparatusSEIKO EPSON CORP·Filed 2017·Granted Aug 7, 2018·0 cites·4 claims
- 2466US11427005B2Liquid absorberSEIKO EPSON CORP·Filed 2020·Granted Aug 30, 2022·0 cites·9 claims
- 2566US6225156B1Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating sameSYMETRIX CORP·Filed 1998·Granted May 1, 2001·27 cites·10 claims
- 2665US11890790B2Pressing machineSEIKO EPSON CORP·Filed 2022·Granted Feb 6, 2024·0 cites·4 claims
- 2765US11491790B2Liquid absorber, liquid-absorbing sheet, liquid absorbent, and image-forming apparatusSEIKO EPSON CORP·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 2865US11351788B2Liquid absorber and image forming apparatusSEIKO EPSON CORP·Filed 2020·Granted Jun 7, 2022·0 cites·8 claims
- 2965US11279135B2Ink absorption memberSEIKO EPSON CORP·Filed 2019·Granted Mar 22, 2022·0 cites·9 claims
- 3065US11046079B2Liquid absorber and liquid ejection apparatusSEIKO EPSON CORP·Filed 2020·Granted Jun 29, 2021·0 cites·12 claims
- 3165US10981353B2Absorbent compositeSEIKO EPSON CORP·Filed 2019·Granted Apr 20, 2021·0 cites·6 claims
- 3264US11891753B2Fiber structure manufacturing apparatus, method of manufacturing fiber structure, and fiber structureSEIKO EPSON CORP·Filed 2021·Granted Feb 6, 2024·0 cites·6 claims
- 3364US6130103AMethod for fabricating ferroelectric integrated circuitsSYMETRIX CORP·Filed 1998·Granted Oct 10, 2000·26 cites·35 claims
- 3462US10953654B2Ink absorber, ink absorbing member accommodation container, and ink absorbing structureSEIKO EPSON CORP·Filed 2019·Granted Mar 23, 2021·0 cites·10 claims
- 3562US10870281B2Liquid absorber, ink absorbing device, and liquid droplet ejection apparatusSEIKO EPSON CORP·Filed 2020·Granted Dec 22, 2020·0 cites·7 claims
- 3662US9162445B2Liquid material discharge control method and droplet discharge deviceMIYASAKA YOICHI·Filed 2008·Granted Oct 20, 2015·2 cites·7 claims
- 3761US12123136B2Raw material supply deviceSEIKO EPSON CORP·Filed 2021·Granted Oct 22, 2024·0 cites·9 claims
- 3860US7592032B2Method of recognizing image of nozzle hole and method of correcting position of liquid droplet ejection head using the same; method of inspecting nozzle hole; apparatus for recognizing image of nozzle hole and liquid droplet ejection apparatus equipped with the same; method of manufacturing electro-optical device; electro-optical device; and electronic equipmentSEIKO EPSON CORP·Filed 2004·Granted Sep 22, 2009·7 cites·4 claims
- 3960US6207465B1Method of fabricating ferroelectric integrated circuit using dry and wet etchingSYMETRIX CORP·Filed 1998·Granted Mar 27, 2001·23 cites·24 claims
- 4060US5498561AMethod of fabricating memory cell for semiconductor integrated circuitNEC CORP·Filed 1992·Granted Mar 12, 1996·19 cites·13 claims
- 4159US11052664B2Liquid absorbing device, control method for liquid absorbing device, and liquid absorbing materialSEIKO EPSON CORP·Filed 2019·Granted Jul 6, 2021·0 cites·8 claims
- 4258US11427002B2Liquid absorbing structure and liquid droplet ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Aug 30, 2022·0 cites·12 claims
- 4358US6570202B2Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating sameSYMETRIX CORP·Filed 2001·Granted May 27, 2003·8 cites·9 claims
- 4458US2020171808A1Absorbent compositeSEIKO EPSON CORP·Filed 2019·Application pending·0 cites
- 4556US10828903B2Ink absorbing member accommodation container and ink absorbing structureSEIKO EPSON CORP·Filed 2019·Granted Nov 10, 2020·0 cites·6 claims
- 4655US11814762B2Fiber structure manufacturing apparatus, fiber structure manufacturing method, and fiber structureSEIKO EPSON CORP·Filed 2021·Granted Nov 14, 2023·0 cites·8 claims
- 4755US5332684AMethod for fabricating thin-film capacitor with restrained leakage current at side and end portions of electrodes in a semiconductor integrated circuit deviceNEC CORP·Filed 1992·Granted Jul 26, 1994·16 cites·9 claims
- 4855US2021230802A1Equipment for manufacturing fiber structure, method for manufacturing fiber structure, and fiber structureSEIKO EPSON CORP·Filed 2021·Application pending·0 cites
- 4954US8033240B2Apparatus for ejecting liquid droplet, work to be applied thereto, method of manufacturing electro-optic device, electro-optic device, and electronic equipmentSEIKO EPSON CORP·Filed 2009·Granted Oct 11, 2011·0 cites·6 claims
- 5053US2020391181A1Liquid absorbent bodySEIKO EPSON CORP·Filed 2020·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →