Inventor · disambiguated record
Yoshihiro Morita
Also filed as: MORITA YOSHIHIRO
25 granted patents·14 pending applications·277 citations·filing 1993–2024
95Inventor score
Top patents by PatentIndex Score
39 records- 0197US6690584B2Information-processing device having a crossbar-board connected to back panels on different sidesFUJITSU LTD·Filed 2001·Granted Feb 10, 2004·179 cites·12 claims
- 0290US9847271B2Semiconductor deviceFUJITSU LTD·Filed 2016·Granted Dec 19, 2017·7 cites·8 claims
- 0384US9252513B2Socket and electronic component mounting structureFUJITSU LTD·Filed 2013·Granted Feb 2, 2016·6 cites·17 claims
- 0478US9195014B2Optical connector, optical connector system and optical backplane apparatus for optically connecting first optical waveguide and second optical waveguideFUJITSU COMPONENT LTD·Filed 2013·Granted Nov 24, 2015·4 cites·11 claims
- 0577US7193861B2Information-processing device having a crossbar-board connected to back panels on different sidesFUJITSU LTD·Filed 2004·Granted Mar 20, 2007·16 cites·10 claims
- 0676US9474147B2Socket for semiconductor component, printed circuit board unit, and information processing apparatusFUJITSU LTD·Filed 2015·Granted Oct 18, 2016·4 cites·9 claims
- 0774US8648260B2Wiring substrateOOI TAKAHIRO·Filed 2011·Granted Feb 11, 2014·4 cites·4 claims
- 0873US7755912B2Printed circuit board unit and electronic apparatusFUJITSU LTD·Filed 2007·Granted Jul 13, 2010·6 cites·15 claims
- 0965US12009132B2Reactor unitTOYOTA MOTOR CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·1 claims
- 1063US7919856B2Package mounted module and package board moduleFUJITSU LTD·Filed 2007·Granted Apr 5, 2011·2 cites·5 claims
- 1160US2025242680A1VehicleTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1258US9049794B2Wiring substrate and method for manufacturing the wiring substrateMORITA YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·1 cites·6 claims
- 1358US7133292B2Information-processing device having a crossbar-board connected to back panels on different sidesFUJITSU LTD·Filed 2004·Granted Nov 7, 2006·5 cites·8 claims
- 1455US2024278649A1Electric vehicleTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1553US2023182661A1Bus bar structure and method of using the sameTOYOTA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 1651US9894769B2Board and cable connection boardFUJITSU LTD·Filed 2017·Granted Feb 13, 2018·0 cites·12 claims
- 1751US7275876B2Optical transmission circuit deviceFUJITSU LTD·Filed 2004·Granted Oct 2, 2007·2 cites·9 claims
- 1851US2006225276A1Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire boardFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1950US8631568B2Printed wiring board manufacturing methodYAMADA TETSURO·Filed 2011·Granted Jan 21, 2014·1 cites·8 claims
- 2050US7538420B2Package mounted moduleFUJITSU LTD·Filed 2007·Granted May 26, 2009·0 cites·4 claims
- 2150US2009173525A1Printed wiring board and printed substrate unitFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2249US2009169842A1Printed wiring board and printed circuit board unitFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2348US2013344714A1Contact device, socket device and electronic apparatusFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2447US9860973B2Contactor with cable and wiring boardFUJITSU LTD·Filed 2016·Granted Jan 2, 2018·0 cites·6 claims
- 2547US2006221587A1Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire boardFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2646US8911243B2Connection member, socket module, socket and method for manufacturing connection memberFUJITSU COMPONENT LTD·Filed 2012·Granted Dec 16, 2014·0 cites·20 claims
- 2746US5577242ASystem for batch transfer file management using a list to organize a batch of blocks into buffersFUJITSU LTD·Filed 1993·Granted Nov 19, 1996·12 cites·18 claims
- 2845US2019165417A1Sulfonylimide Compound, Production Method Thereof, Electrolyte Composition, Electrolytic Solution and Lithium Ion BatteryNIPPON CATALYTIC CHEM IND·Filed 2018·Application pending·0 cites
- 2945US2005162840A1Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire boardFiled 2005·Application pending·0 cites
- 3043US8513537B2Printed board and method of manufacturing printed boardOOI TAKAHIRO·Filed 2010·Granted Aug 20, 2013·0 cites·6 claims
- 3140US5584029AData protecting system for an echangeable storage medium comprising power supply control means, medium detection means and medium identifying meansFUJITSU LTD·Filed 1993·Granted Dec 10, 1996·13 cites·18 claims
- 3240US2005231929A1Board mounting method and mounting structureFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3338US2011241233A1Method for manufacturing optical waveguideFUJITSU LTD·Filed 2011·Application pending·0 cites
- 3438US2017068055A1Optical module connector and printed board assemblyFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3537US6633488B1Printed circuit board unit with correction memberFUJITSU LTD·Filed 1999·Granted Oct 14, 2003·6 cites·17 claims
- 3637US2019191596A1Electrical apparatusTOYOTA MOTOR CO LTD·Filed 2018·Application pending·0 cites
- 3736US9496634B2Interposer, printed board unit, and information processing apparatusFUJITSU LTD·Filed 2015·Granted Nov 15, 2016·0 cites·16 claims
- 3834US6023412ASystem board device having a displaceable daughter-board coverFUJITSU LTD·Filed 1999·Granted Feb 8, 2000·7 cites·6 claims
- 3931US6248957B1Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing memberFUJITSU LTD·Filed 1999·Granted Jun 19, 2001·2 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Yoshihiro Morita files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →