Inventor · disambiguated record
Yoji Murakami
Also filed as: MURAKAMI YOJI
13 granted patents·251 citations·filing 1988–1995
93Inventor score
Top patents by PatentIndex Score
13 records- 0180US4900485AMethod and apparatus for transfer moldingFUJITSU LTD·Filed 1988·Granted Feb 13, 1990·42 cites·18 claims
- 0275US5372867APolyester film for laminated metal sheet drawing and processing containing solid lubricant and having specified protrusion rateTEIJIN LTD·Filed 1991·Granted Dec 13, 1994·38 cites·2 claims
- 0373US5384354APolyester film for lamination onto metal sheet for processing of said sheet, and use thereofTEIJIN LTD·Filed 1993·Granted Jan 24, 1995·33 cites·11 claims
- 0471US5618621ABiaxially oriented laminated polyester film for use as film to be bonded onto metal sheetTEIJIN LTD·Filed 1995·Granted Apr 8, 1997·30 cites·16 claims
- 0570US5077118AStamping foilTEIJIN LTD·Filed 1990·Granted Dec 31, 1991·20 cites·4 claims
- 0664US5240779APolyester film for fabricationTEIJIN LTD·Filed 1992·Granted Aug 31, 1993·19 cites·1 claims
- 0761US4977442ALead frame and method of producing electronic components using such improved lead frameFUJITSU LTD·Filed 1989·Granted Dec 11, 1990·23 cites·3 claims
- 0856US5094982ALead frame and method of producing electronic components using such improved lead frameFUJITSU LTD·Filed 1990·Granted Mar 10, 1992·23 cites·3 claims
- 0943US5473004APolyester film for fabricationTEIJIN LTD·Filed 1994·Granted Dec 5, 1995·7 cites·5 claims
- 1037US5069944AThermal transfer record sheetTEIJIN LTD·Filed 1990·Granted Dec 3, 1991·6 cites·2 claims
- 1134US5473199ASemiconductor device having a body with a carrier ring connected theretoFUJITSU LTD·Filed 1993·Granted Dec 5, 1995·5 cites·10 claims
- 1233US5610080AMethod for producing semiconductor device having a body with a carrier ring connected theretoFUJITSU LTD·Filed 1995·Granted Mar 11, 1997·3 cites·7 claims
- 1330US4937224AThermal transfer record sheetTEIJIN LTD·Filed 1989·Granted Jun 26, 1990·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →