Inventor · disambiguated record
Yosuke Nakanishi
Also filed as: NAKANISHI YOSUKE
17 granted patents·20 pending applications·16 citations·filing 2010–2025
88Inventor score
Top patents by PatentIndex Score
37 records- 0190US9733144B2Electronic device, control method, and control programKYOCERA CORP·Filed 2016·Granted Aug 15, 2017·7 cites·17 claims
- 0280US9716006B2Semiconductor device manufacturing method and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 25, 2017·3 cites·11 claims
- 0373US10707146B2Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivityMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 7, 2020·2 cites·12 claims
- 0473US10643967B2Power semiconductor device that includes a copper layer disposed on an electrode and located away from a polyimide layer and method for manufacturing the power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 5, 2020·2 cites·11 claims
- 0570US2025254967A1Silicon carbide semiconductor device, power converter, and method for manufacturing silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0669US9842738B2Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Dec 12, 2017·2 cites·18 claims
- 0766US12238859B2Wiring circuit boardNITTO DENKO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·6 claims
- 0865US12238858B2Wiring circuit boardNITTO DENKO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·7 claims
- 0962US12356696B2Silicon carbide semiconductor device, power converter, and method for manufacturing silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jul 8, 2025·0 cites·13 claims
- 1059US11991871B2Impedance matching film for radio wave absorber, impedance matching film-attached film for radio wave absorber, radio wave absorber, and laminate for radio wave absorberNITTO DENKO CORP·Filed 2019·Granted May 21, 2024·0 cites·12 claims
- 1159US2025241206A1Magnetic-thin-film-equipped substrate, magnetic thermoelectric conversion element, sensor, and method for manufacturing magnetic-thin-film-equipped substrateNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1254US12132254B2Impedance matching film for radio wave absorber, impedance matching film-attached film for radio wave absorber, radio wave absorber, and laminate for radio wave absorberNITTO DENKO CORP·Filed 2020·Granted Oct 29, 2024·0 cites·9 claims
- 1354US2024341192A1Thermoelectric conversion elementUNIV TOKYO·Filed 2022·Application pending·0 cites
- 1453US2024312805A1Method for manufacturing a semiconductor apparatus, semiconductor manufacturing apparatus and semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1553US2024341191A1Thermoelectric conversion elementNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1652US12451355B2Method of manufacturing semiconductor device and semiconductor manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Oct 21, 2025·0 cites·4 claims
- 1752US11778699B2HeaterNITTO DENKO CORP·Filed 2018·Granted Oct 3, 2023·0 cites·11 claims
- 1852US2025017111A1Thermoelectric conversion element and method for manufacturing thermoelectric conversion elementNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1951US11933997B2Heat-ray-transmission-controllable, light-transmissive base material and light-transmissive base material unitNITTO DENKO CORP·Filed 2018·Granted Mar 19, 2024·0 cites·8 claims
- 2051US2024341193A1Thermoelectric conversion elementUNIV TOKYO·Filed 2022·Application pending·0 cites
- 2151US2022330464A1Impedance matching film and radio wave absorberNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2250US2025008841A1Thermoelectric conversion element and sensorNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 2348US2024032268A1Radio wave absorber and laminate for radio wave absorberNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2447US2023144249A1Radio wave absorberNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2546US10209414B2Infrared-reflecting filmNITTO DENKO CORP·Filed 2015·Granted Feb 19, 2019·0 cites·15 claims
- 2644US2023139063A1Impedance-matching membrane and radio-wave-absorbing bodyNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2742US2021298129A1Heater and article equipped with heaterNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 2840US8700103B2Vehicle terminal apparatus and program product for vehicle terminal apparatusOZAKI TAKAHISA·Filed 2010·Granted Apr 15, 2014·0 cites·12 claims
- 2940US2022167463A1HeaterNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 3040US2015053650A1Wire discharge machining apparatus and manufacturing method for semiconductor wafers using the sameMIYAKE HIDETAKA·Filed 2012·Application pending·0 cites
- 3140US2020115956A1Heat-ray-reflective, light-transmissive base material, and heat-ray-reflective windowNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 3240US2011316964A1Wireless communication deviceNAKANISHI YOSUKE·Filed 2011·Application pending·0 cites
- 3339US2023155268A1Impedance matching film and radio wave absorberNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 3438US10051189B2Electronic device, control method, and control programKYOCERA CORP·Filed 2016·Granted Aug 14, 2018·0 cites·5 claims
- 3537US10677585B2Film thickness measuring apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 9, 2020·0 cites·11 claims
- 3636US2017227694A1Infrared reflecting substrateNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 3735US2017150532A1Wireless communication system, information terminal and communication deviceAISIN AW CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →