Inventor · disambiguated record
Yoshiyuki Nakao
Also filed as: NAKAO YOSHIYUKI
29 granted patents·1 pending application·222 citations·filing 1996–2018
96Inventor score
Files withFUJITSU LTD9HANEDA MASAKI3FUJITSU MICROELECTRONICS LTD2FUJITSU SEMICONDUCTOR LTD2HIBINO TAKASHI2
Top patents by PatentIndex Score
30 records- 0196US7507666B2Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main compositionFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 24, 2009·49 cites·7 claims
- 0292US8168532B2Method of manufacturing a multilayer interconnection structure in a semiconductor deviceHANEDA MASAKI·Filed 2008·Granted May 1, 2012·21 cites·13 claims
- 0392US7413977B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodFUJITSU LTD·Filed 2005·Granted Aug 19, 2008·17 cites·4 claims
- 0491US7507659B2Fabrication process of a semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Mar 24, 2009·23 cites·12 claims
- 0589US6750541B2Semiconductor deviceFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·47 cites·17 claims
- 0685US7846833B2Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor deviceFUJITSU LTD·Filed 2010·Granted Dec 7, 2010·7 cites·7 claims
- 0784US11193910B2Device and method of detecting magnetic characteristic change for long materialNIPPON STEEL CORP·Filed 2018·Granted Dec 7, 2021·2 cites·21 claims
- 0883US7256500B2Semiconductor device using metal nitride as insulating filmFUJITSU LTD·Filed 2006·Granted Aug 14, 2007·6 cites·2 claims
- 0982US8071474B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodSHIMIZU NORIYOSHI·Filed 2010·Granted Dec 6, 2011·4 cites·7 claims
- 1076US8104349B2Flaw detection tracking device for pipe or tube and automatic flaw detecting apparatus for pipe or tube using the sameKUBOTA HIROSHI·Filed 2007·Granted Jan 31, 2012·5 cites·7 claims
- 1173US7816279B2Semiconductor device and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Oct 19, 2010·3 cites·7 claims
- 1273US7713869B2Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 11, 2010·5 cites·5 claims
- 1366US7042093B2Semiconductor device using metal nitride as insulating filmFUJITSU LTD·Filed 2003·Granted May 9, 2006·7 cites·2 claims
- 1463US8803516B2Eddy current testing method and apparatus for inspecting an object for flawsHIBINO TAKASHI·Filed 2009·Granted Aug 12, 2014·2 cites·6 claims
- 1563US6992005B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Jan 31, 2006·9 cites·14 claims
- 1662US7935624B2Fabrication method of semiconductor device having a barrier layer containing MnFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted May 3, 2011·2 cites·17 claims
- 1761US8067836B2Semiconductor device with reduced increase in copper film resistanceHANEDA MASAKI·Filed 2009·Granted Nov 29, 2011·1 cites·6 claims
- 1857US8067309B2Semiconductor device using metal nitride as insulating film and its manufacture methodSHIMIZU NORIYOSHI·Filed 2008·Granted Nov 29, 2011·0 cites·4 claims
- 1955US2007252280A1Semiconductor device using metal nitride as insulating filmFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2052US11965856B2Method and device for detecting metal residue in electric-resistance-welded steel pipeNIPPON STEEL CORP·Filed 2018·Granted Apr 23, 2024·0 cites·22 claims
- 2150US5667942AResist pattern forming methodFUJITSU LTD·Filed 1996·Granted Sep 16, 1997·12 cites·12 claims
- 2249US9559058B2Semiconductor device and method for manufacturing the sameHANEDA MASAKI·Filed 2012·Granted Jan 31, 2017·0 cites·8 claims
- 2346US8552717B2Eddy current testing method and eddy current testing apparatusHYODO SHIGETOSHI·Filed 2008·Granted Oct 8, 2013·0 cites·2 claims
- 2445US9291599B2Magnetic testing method and apparatusSUZUMA TOSHIYUKI·Filed 2012·Granted Mar 22, 2016·0 cites·2 claims
- 2545US8497208B2Semiconductor device and method for manufacturing the sameSUNAYAMA MICHIE·Filed 2010·Granted Jul 30, 2013·0 cites·11 claims
- 2643US10416123B2Flaw detection sensitivity adjustment method and abnormality diagnosis method for ultrasonic probeNIPPON STEEL & SUMITOMO METAL CORP·Filed 2013·Granted Sep 17, 2019·0 cites·2 claims
- 2738US8685265B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusNAKAO YOSHIYUKI·Filed 2012·Granted Apr 1, 2014·0 cites·11 claims
- 2836US9121833B2Defect inspecting apparatusANAYAMA KAZUNORI·Filed 2012·Granted Sep 1, 2015·0 cites·7 claims
- 2936US8638091B2Rotary eddy current testing probe deviceHIBINO TAKASHI·Filed 2011·Granted Jan 28, 2014·0 cites·5 claims
- 3034US8027796B2S/N ratio measuring method in eddy current testing on internal surface of pipe or tubeSUMITOMO METAL IND·Filed 2006·Granted Sep 27, 2011·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →