Inventor · disambiguated record
Yoshiki Nakashima
Also filed as: NAKASHIMA YOSHIKI
16 granted patents·30 pending applications·105 citations·filing 2003–2023
91Inventor score
Top patents by PatentIndex Score
46 records- 0195US8569892B2Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2009·Granted Oct 29, 2013·41 cites·9 claims
- 0290US9529242B2Display apparatus and display apparatus manufacturing methodSEIKO EPSON CORP·Filed 2015·Granted Dec 27, 2016·5 cites·10 claims
- 0388US8710639B2Semiconductor element-embedded wiring substrateKIKUCHI KATSUMI·Filed 2011·Granted Apr 29, 2014·11 cites·21 claims
- 0487US8692135B2Wiring board capable of containing functional element and method for manufacturing sameFUNAYA TAKUO·Filed 2009·Granted Apr 8, 2014·25 cites·2 claims
- 0585US8766440B2Wiring board with built-in semiconductor elementKIKUCHI KATSUMI·Filed 2011·Granted Jul 1, 2014·9 cites·29 claims
- 0684US11175572B2Light emitting device and projectorSEIKO EPSON CORP·Filed 2020·Granted Nov 16, 2021·1 cites·7 claims
- 0774US7759658B2Ion implanting apparatusNISSIN ION EQUIPMENT CO LTD·Filed 2009·Granted Jul 20, 2010·3 cites·8 claims
- 0872US8929090B2Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2011·Granted Jan 6, 2015·4 cites·19 claims
- 0970US8810008B2Semiconductor element-embedded substrate, and method of manufacturing the substrateMORI KENTARO·Filed 2011·Granted Aug 19, 2014·3 cites·29 claims
- 1069US12503734B2Cellulose saccharification methodSEIKO EPSON CORP·Filed 2023·Granted Dec 23, 2025·0 cites·5 claims
- 1166US8692364B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2010·Granted Apr 8, 2014·2 cites·20 claims
- 1265US2024141073A1Method for manufacturing cellulose derivativeSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1365US2023383325A1Method of saccharifying celluloseSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1465US2023383326A1Cellulose saccharification methodSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1564US2023250457A1Method for saccharifying celluloseSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1664US2023250459A1Cellulose saccharification methodSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1758US2024186002A1Information processing apparatus, feature quantity extraction method, training data generation method, estimation model generation method, stress level estimation method, and storage mediumNEC CORP·Filed 2021·Application pending·0 cites
- 1858US2024425886A1Method for producing modified human induced pluripotent stem cellsCIRA FOUND·Filed 2021·Application pending·0 cites
- 1952US2024104430A1Information processing apparatus, feature quantity selection method, training data generation method, estimation model generation method, stress level estimation method, and storage mediumNEC CORP·Filed 2021·Application pending·0 cites
- 2050US2014024177A1Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2013·Application pending·0 cites
- 2149US2024081707A1Stress level estimation method, training data generation method, and storage mediumNEC CORP·Filed 2021·Application pending·0 cites
- 2248US2015053474A1Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2014·Application pending·0 cites
- 2348US2024185124A1Learning device, stress estimation device, learning method, stress estimation method, and storage mediumNEC CORP·Filed 2021·Application pending·0 cites
- 2447US2022167915A1Stress estimation apparatus, stress estimation method, and computer readable recording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 2546US2022160243A1Pulse determination apparatus, stress determination apparatus, pulse determination method, and computer-readable recording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 2645US7354700B2Method for manufacturing insulating resin layer, substrate for electro-optical devices, method for manufacturing electro-optical device, and electro-optical deviceSEIKO EPSON CORP·Filed 2003·Granted Apr 8, 2008·1 cites·5 claims
- 2743US2023122854A1Stress management apparatus, stress management method, and computer readablerecording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 2843US2010026941A1Electro-optical device and manufacturing method of electro-optical deviceSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 2943US2023144812A1Stress tolerable amount calculation apparatus, stress tolerable amount calculation method, and computer readable recording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 3043US2023101907A1Stress release degree calculation apparatus, stress release degree calculationmethod, and computer readable recording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 3143US2023077694A1Stress estimation apparatus, stress estimation method, and computer readable recording mediumNEC CORP·Filed 2020·Application pending·0 cites
- 3242US2015034373A1Wiring structure and manufacturing method thereofNAKASHIMA YOSHIKI·Filed 2013·Application pending·0 cites
- 3341US2017188927A1Emotion recognition device, emotion recognition method, and storage medium for storing emotion recognition programNEC CORP·Filed 2015·Application pending·0 cites
- 3441US2019298227A1Tremor detector, stress assessment system including the same, and method of assessing stressNEC CORP·Filed 2017·Application pending·0 cites
- 3540US8710669B2Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layerMORI KENTARO·Filed 2010·Granted Apr 29, 2014·0 cites·18 claims
- 3639US2016238918A1Electrophoresis display apparatus, manufacturing method of electrophoresis display apparatus, and electronic deviceSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3739US2011215478A1Semiconductor element-embedded wiring substrateNEC CORP·Filed 2011·Application pending·0 cites
- 3838US2013127037A1Semiconductor device built-in substrateMORI KENTARO·Filed 2011·Application pending·0 cites
- 3937US2013088841A1Substrate with built-in functional elementOHSHIMA DAISUKE·Filed 2011·Application pending·0 cites
- 4037US2013050967A1Functional device-embedded substrateOHSHIMA DAISUKE·Filed 2011·Application pending·0 cites
- 4135US8921240B2Ion implantation methodKAWAMURA YASUNORI·Filed 2012·Granted Dec 30, 2014·0 cites·6 claims
- 4235US8872334B2Method for manufacturing semiconductor deviceYAMAMICHI SHINTARO·Filed 2011·Granted Oct 28, 2014·0 cites·8 claims
- 4335US2012300989A1Imaging device, biometric authentication device, electronic equipmentNAKASHIMA YOSHIKI·Filed 2012·Application pending·0 cites
- 4434US2017281022A1Detection device, first detection system, and second detection systemSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 4533US2017198262A1Culture medium and culturing method for anchorage-dependent cells, cell composition including stem cells and/or differentiated cells derived from stem cells, and production method for cell compositionKYOWA HAKKO KIRIN CO LTD·Filed 2015·Application pending·0 cites
- 4632US9786501B2Photoresist film placing method, semiconductor device manufacturing method, electro-optical device, and electronic deviceSEIKO EPSON CORP·Filed 2015·Granted Oct 10, 2017·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Yoshiki Nakashima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →