Inventor · disambiguated record
Yoshihiro Nakata
Also filed as: NAKATA YOSHIHIRO
73 granted patents·21 pending applications·1,015 citations·filing 1987–2025
99Inventor score
Files withFUJITSU LTD51SUNSTAR ENGINEERING INC10ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL4OZAKI SHIROU4TOYOTA MOTOR CO LTD4
Top patents by PatentIndex Score
94 records- 0195US5602060AProcess for the production of semiconductor devicesFUJITSU LTD·Filed 1996·Granted Feb 11, 1997·479 cites·10 claims
- 0294US6657035B1Moisture-curable one-pack-type urethane adhesive compositionSUNSTAR ENGINEERING INC·Filed 2000·Granted Dec 2, 2003·53 cites·6 claims
- 0394US6613834B2Low dielectric constant film material, film and semiconductor device using such materialFUJITSU LTD·Filed 2001·Granted Sep 2, 2003·51 cites·6 claims
- 0491US6780498B2Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant filmFUJITSU LTD·Filed 2001·Granted Aug 24, 2004·31 cites·13 claims
- 0589US7909701B2Power transmission apparatusDENSO CORP·Filed 2008·Granted Mar 22, 2011·11 cites·8 claims
- 0689US7262142B2Semiconductor device fabrication methodFUJITSU LTD·Filed 2005·Granted Aug 28, 2007·14 cites·17 claims
- 0784US11225984B2Actuator device, humanoid robot and power assist deviceADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL·Filed 2015·Granted Jan 18, 2022·3 cites·5 claims
- 0884US8956967B2Method of forming an interconnection structureOZAKI SHIROU·Filed 2012·Granted Feb 17, 2015·5 cites·15 claims
- 0984US6958525B2Low dielectric constant film material, film and semiconductor device using such materialFUJITSU LTD·Filed 2003·Granted Oct 25, 2005·17 cites·6 claims
- 1084US5770260AProcess for forming silicon dioxide filmFUJITSU LTD·Filed 1997·Granted Jun 23, 1998·63 cites·7 claims
- 1184US5304623AOne-pack type heat precurable moisture-curing sealant composition comprising isocyanate containing component and siloxane containing polyolSUNSTAR ENGINEERING INC·Filed 1993·Granted Apr 19, 1994·31 cites·20 claims
- 1283US7476970B2Composition for forming insulating film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jan 13, 2009·7 cites·1 claims
- 1382US7659357B2Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2005·Granted Feb 9, 2010·10 cites·2 claims
- 1480US6727515B2Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor deviceFUJITSU LTD·Filed 2002·Granted Apr 27, 2004·15 cites·21 claims
- 1580US5459185AOne-part moisture-curing orethane adhesiveSUNSTAR ENGINEERING INC·Filed 1994·Granted Oct 17, 1995·26 cites·16 claims
- 1677US8431464B2Process for producing silicic coating, silicic coating and semiconductor deviceKOBAYASHI YASUSHI·Filed 2010·Granted Apr 30, 2013·2 cites·19 claims
- 1776US5034453AMoisture-curing hot-melt sealantSUNSTAR ENGINEERING INC·Filed 1990·Granted Jul 23, 1991·23 cites·6 claims
- 1875US11635096B2Actuator device, humanoid robot and power assist deviceADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL·Filed 2021·Granted Apr 25, 2023·0 cites·8 claims
- 1974US11794336B2Externally-driven joint structureADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL·Filed 2022·Granted Oct 24, 2023·0 cites·12 claims
- 2073US8164166B2Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor deviceIMADA TADAHIRO·Filed 2008·Granted Apr 24, 2012·4 cites·16 claims
- 2173US7728065B2Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jun 1, 2010·5 cites·8 claims
- 2270US7875981B2Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Granted Jan 25, 2011·1 cites·15 claims
- 2369US8449787B2Method for wet etching while forming interconnect trench in insulating filmIMADA TADAHIRO·Filed 2008·Granted May 28, 2013·2 cites·7 claims
- 2468US7830012B2Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor deviceFUJITSU LTD·Filed 2010·Granted Nov 9, 2010·2 cites·19 claims
- 2568US7830013B2Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereofFUJITSU LTD·Filed 2006·Granted Nov 9, 2010·1 cites·13 claims
- 2667US9263326B2Interconnection structure and method of forming the sameFUJITSU LTD·Filed 2015·Granted Feb 16, 2016·1 cites·9 claims
- 2767US8399295B2Semiconductor device and its manufacture methodKISHII SADAHIRO·Filed 2011·Granted Mar 19, 2013·3 cites·9 claims
- 2867US7709394B2Substrate processing method and apparatus fabrication process of a semiconductor deviceTOKYO ELECTRON LTD·Filed 2007·Granted May 4, 2010·2 cites·8 claims
- 2967US7655576B2Insulator film, manufacturing method of multilayer wiring device and multilayer wiring deviceFUJITSU LTD·Filed 2007·Granted Feb 2, 2010·2 cites·9 claims
- 3066US12193151B2High-frequency circuit board and antenna moduleFUJITSU LTD·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 3166US8716209B2Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor deviceKOBAYASHI YASUSHI·Filed 2009·Granted May 6, 2014·2 cites·28 claims
- 3265US4804710AEpoxy resin compositionSUNSTAR ENGINEERING INC·Filed 1987·Granted Feb 14, 1989·14 cites·4 claims
- 3364US8723375B2Linear actuatorHIURA RYOTA·Filed 2009·Granted May 13, 2014·5 cites·20 claims
- 3464US8461041B2Semiconductor device and method of manufacturing semiconductor deviceOZAKI SHIROU·Filed 2010·Granted Jun 11, 2013·1 cites·12 claims
- 3564US5659004AEpoxy resin compositionFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·31 cites·19 claims
- 3664US2025079374A1Semiconductor device and electronic apparatusFUJITSU LTD·Filed 2024·Application pending·0 cites
- 3763US7235866B2Low dielectric constant film material, film and semiconductor device using such materialFUJITSU LTD·Filed 2005·Granted Jun 26, 2007·2 cites·3 claims
- 3863US2025379116A1Semiconductor device and mounting methodFUJITSU LTD·Filed 2025·Application pending·0 cites
- 3962US7470975B2Composition for forming insulation film, insulation film for semiconductor device, and fabrication method and semiconductor device thereofFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·0 cites·20 claims
- 4062US7358299B2Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant filmFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·4 cites·7 claims
- 4161US12185502B2Semiconductor apparatus and electronic apparatusFUJITSU LTD·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
- 4261US7232769B2Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating filmFUJITSU LTD·Filed 2003·Granted Jun 19, 2007·7 cites·32 claims
- 4361US2023400152A1Gas filling systemTOYOTA MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 4460US12148724B2Package with built-in electronic components and electronic deviceFUJITSU LTD·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 4559US12494449B2Semiconductor device with antennaFUJITSU LTD·Filed 2023·Granted Dec 9, 2025·0 cites·12 claims
- 4659US8124239B2Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the sameNAKATA YOSHIHIRO·Filed 2009·Granted Feb 28, 2012·0 cites·3 claims
- 4758US7985700B2Composition for forming insulating film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2008·Granted Jul 26, 2011·0 cites·11 claims
- 4857US8378489B2Semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2009·Granted Feb 19, 2013·0 cites·19 claims
- 4956US9354517B2Resist composition and method for forming patternFUJITSU LTD·Filed 2013·Granted May 31, 2016·0 cites·10 claims
- 5056US6348123B1Method for adhering polyolefin materialsSUNSTAR ENGINEERING INC·Filed 1999·Granted Feb 19, 2002·15 cites·5 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →