Inventor · disambiguated record
Yosuke Nakata
Also filed as: NAKATA YOSUKE
26 granted patents·9 pending applications·20 citations·filing 2011–2025
91Inventor score
Top patents by PatentIndex Score
35 records- 0192US10388589B2Semiconductor device, inverter device, and vehicleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 20, 2019·11 cites·15 claims
- 0278US11025245B2Power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 1, 2021·3 cites·1 claims
- 0377US11901341B2Semiconductor package and production method thereof, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 13, 2024·2 cites·37 claims
- 0474US12347814B2Semiconductor package and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Jul 1, 2025·0 cites·28 claims
- 0569US9653390B2Semiconductor device and semiconductor device manufacturing methodNAKATA YOSUKE·Filed 2012·Granted May 16, 2017·3 cites·13 claims
- 0664US2025253200A1Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0762US2025212334A1Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0860US2024422914A1Semiconductor device, power conversion device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0958US10157865B2Semiconductor device with metal film and method for manufacturing semiconductor device with metal filmMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Dec 18, 2018·1 cites·15 claims
- 1058US2024402583A1ProjectorSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 1157US2025259961A1Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1255US11777419B2Semiconductor device, semiconductor device manufacturing method, and power converterMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Oct 3, 2023·0 cites·8 claims
- 1354US11887933B2Manufacturing method of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 1454US11387158B2Semiconductor device and semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jul 12, 2022·0 cites·11 claims
- 1553US11848298B2Semiconductor apparatus, power module, and manufacturing method of semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 19, 2023·0 cites·11 claims
- 1653US2023238295A1Semiconductor device, method of manufacturing semiconductor device, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1752US11462516B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Oct 4, 2022·0 cites·13 claims
- 1851US9911705B2Semiconductor device and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 6, 2018·0 cites·7 claims
- 1949US11508698B2Semiconductor package and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 22, 2022·0 cites·8 claims
- 2049US11302538B2Semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 12, 2022·0 cites·12 claims
- 2149US2025374572A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2247US2021366788A1Method for manufacturing semiconductor device and method for manufacturing power control circuitMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2346US11430726B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 30, 2022·0 cites·18 claims
- 2444US11450592B2Semiconductor package with a plurality of chips having a groove in the encapsulationMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 20, 2022·0 cites·20 claims
- 2544US10461049B2Semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 29, 2019·0 cites·13 claims
- 2643US10770376B2Semiconductor device, inverter unit and automobileMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 8, 2020·0 cites·16 claims
- 2742US2025362183A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2841US11264245B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 1, 2022·0 cites·5 claims
- 2941US11251098B2Semiconductor device, production method therefor, and automobileMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 15, 2022·0 cites·10 claims
- 3040US12009332B2Semiconductor device having high yield strength intermediate plateMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 11, 2024·0 cites·19 claims
- 3140US10896863B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 19, 2021·0 cites·22 claims
- 3240US9243093B2Modifier for polyolefin resinHASEGAWA TATSUHIKO·Filed 2011·Granted Jan 26, 2016·0 cites·16 claims
- 3339US10825751B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 3, 2020·0 cites·14 claims
- 3439US10177109B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 8, 2019·0 cites·10 claims
- 3538US10504820B2Semiconductor module and electric power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 10, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →