Inventor · disambiguated record
Yoshiharu Ogata
Also filed as: OGATA YOSHIHARU
11 granted patents·5 pending applications·97 citations·filing 2004–2011
87Inventor score
Top patents by PatentIndex Score
16 records- 0196US7476975B2Semiconductor device and resin structure thereforSEIKO EPSON CORP·Filed 2005·Granted Jan 13, 2009·77 cites·14 claims
- 0275US7569922B2Semiconductor device having a bonding wire and method for manufacturing the sameSEIKO EPSON CORP·Filed 2007·Granted Aug 4, 2009·7 cites·11 claims
- 0357US7982319B2Semiconductor device with improved resin configurationSEIKO EPSON CORP·Filed 2009·Granted Jul 19, 2011·0 cites·7 claims
- 0457US7656026B2Semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Feb 2, 2010·3 cites·5 claims
- 0555US7656044B2Semiconductor device with improved resin configurationSEIKO EPSON CORP·Filed 2008·Granted Feb 2, 2010·0 cites·14 claims
- 0654US8368233B2Semiconductor device with improved resin configurationSEIKO EPSON CORP·Filed 2011·Granted Feb 5, 2013·0 cites·6 claims
- 0753US7521293B2Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Apr 21, 2009·6 cites·15 claims
- 0850US2008274588A1Semiconductor device and method of fabricating the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 0949US7154188B2Semiconductor chip, semiconductor device, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Dec 26, 2006·4 cites·8 claims
- 1047US7410827B2Semiconductor device and method of fabricating the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2006·Granted Aug 12, 2008·0 cites·13 claims
- 1147US2007296087A1Semiconductor device and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1240US2005023666A1Semiconductor device and method of fabricating the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 1338US7179687B2Semiconductor device and its manufacturing method, and semiconductor device manufacturing systemSEIKO EPSON CORP·Filed 2004·Granted Feb 20, 2007·0 cites·6 claims
- 1436US8749041B2Thee-dimensional integrated semiconductor device and method for manufacturing sameOGATA YOSHIHARU·Filed 2010·Granted Jun 10, 2014·0 cites·12 claims
- 1536US2004222509A1Semiconductor device, electronic device, electronic equipment and manufacturing method thereofSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 1636US2004245652A1Semiconductor device, electronic device, electronic appliance, and method of manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →