Inventor · disambiguated record
Youngseok Oh
Also filed as: OH YOUNGSEOK
6 granted patents·5 pending applications·7 citations·filing 2012–2024
71Inventor score
Files withINTEL CORP6KOREA INST MACH & MATERIALS2KOLON INC1KOREA INSTITUTE MATERIALS SCIENCE1OH YOUNGSEOK1
Top patents by PatentIndex Score
11 records- 0177US9523713B2Interconnects including liquid metalINTEL CORP·Filed 2013·Granted Dec 20, 2016·5 cites·16 claims
- 0260US10570561B2Sizing agent for carbon fiber, carbon fiber with improved interfacial adhesion, polymerization reaction type carbon fiber-reinforced polymer composite material using same, and production method thereforKOREA INST MACH & MATERIALS·Filed 2016·Granted Feb 25, 2020·0 cites·11 claims
- 0360US9674943B2Actuation mechanisms for electrical interconnectionsINTEL CORP·Filed 2012·Granted Jun 6, 2017·1 cites·8 claims
- 0458US12327893B2Humidifier for fuel cellKOLON INC·Filed 2021·Granted Jun 10, 2025·0 cites·10 claims
- 0557US2025171602A1High heat-resistant carbon nanostructure polymer composite and hybrid composite including the sameKOREA INSTITUTE MATERIALS SCIENCE·Filed 2024·Application pending·0 cites
- 0656US10644458B2Shielded interconnect arrayINTEL CORP·Filed 2017·Granted May 5, 2020·1 cites·10 claims
- 0752US11656247B2Micro-coaxial wire interconnect architectureINTEL CORP·Filed 2017·Granted May 23, 2023·0 cites·25 claims
- 0852US2017273176A1Actuation mechanisms for electrical interconnectionsINTEL CORP·Filed 2017·Application pending·0 cites
- 0943US2016178663A1Formed wire probe interconnect for test die contactorINTEL CORP·Filed 2014·Application pending·0 cites
- 1041US2019241697A1Chemically decomposable thermosetting resin composition for recycling fiber-reinforced composite and dissolving method thereofKOREA INST MACH & MATERIALS·Filed 2017·Application pending·0 cites
- 1138US2014139247A1Interposer apparatus and methodsOH YOUNGSEOK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →