Inventor · disambiguated record
Yoshikazu Ohtani
Also filed as: OHTANI YOSHIKAZU
6 granted patents·5 pending applications·44 citations·filing 1998–2022
73Inventor score
Top patents by PatentIndex Score
11 records- 0172US6351367B1Electrostatic holding apparatus having insulating layer with enables easy attachment and detachment of semiconductor objectSHINETSU CHEMICAL CO·Filed 1998·Granted Feb 26, 2002·43 cites·2 claims
- 0264US10840141B2Workpiece-separating device and workpiece-separating methodSHIN ETSU ENG CO LTD·Filed 2019·Granted Nov 17, 2020·1 cites·4 claims
- 0358US2024399497A1Processing apparatus, processing method, and manufacturing method of substrateSHIN ETSU ENG CO LTD·Filed 2021·Application pending·0 cites
- 0452US2025018510A1Laser lift-off method, method for manufacturing receptor substrate, laser lift-off apparatus, and photomaskSHIN ETSU ENG CO LTD·Filed 2022·Application pending·0 cites
- 0544US11251058B1Workpiece-separating device and workpiece-separating methodSHIN ETSU ENG CO LTD·Filed 2021·Granted Feb 15, 2022·0 cites·4 claims
- 0642US2024051068A1Transfer apparatus and transfer methodSHIN ETSU ENG CO LTD·Filed 2021·Application pending·0 cites
- 0740US11633810B2Workpiece-separating device and workpiece-separating methodSHIN ETSU ENG CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·9 claims
- 0840US11322384B2Substrate processing apparatus and substrate processing methodSHIN ETSU ENG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 0940US2023321752A1Workpiece separation device and workpiece separation methodSHIN ETSU ENG CO LTD·Filed 2021·Application pending·0 cites
- 1036US11654513B2Workpiece-separating device and workpiece-separating methodSHIN ETSU ENG CO LTD·Filed 2019·Granted May 23, 2023·0 cites·12 claims
- 1128US2019109021A1Resin-sealing device and resin-sealing methodSHIN ETSU ENG CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →