Inventor · disambiguated record
Yoshifumi Okabe
Also filed as: OKABE YOSHIFUMI · TOMATSU YUTAKA
26 granted patents·6 pending applications·393 citations·filing 1991–2016
97Inventor score
Files withDENSO CORP18NIPPON DENSO CO7ALPS ELECTRIC CO LTD2KYOCERA CONNECTOR PROD CORP2AUTONETWORKS TECHNOLOGIES LTD1
Top patents by PatentIndex Score
32 records- 0191US7977704B2Semiconductor device having insulated gate semiconductor element, and insulated gate bipolar transistorDENSO CORP·Filed 2009·Granted Jul 12, 2011·19 cites·7 claims
- 0290US8097901B2Semiconductor device having insulated gate semiconductor element, and insulated gate bipolar transistorKOYAMA MASAKI·Filed 2011·Granted Jan 17, 2012·11 cites·4 claims
- 0380US6817874B2Card connector device for ejecting card by sliderALPS ELECTRIC CO LTD·Filed 2003·Granted Nov 16, 2004·28 cites·6 claims
- 0479US7420246B2Vertical type semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2006·Granted Sep 2, 2008·7 cites·14 claims
- 0579US5689130AVertical semiconductor device with ground surface providing a reduced ON resistanceNIPPON DENSO CO·Filed 1995·Granted Nov 18, 1997·32 cites·51 claims
- 0679US5250449AVertical type semiconductor device and method for producing the sameNIPPON DENSO CO·Filed 1991·Granted Oct 5, 1993·45 cites·9 claims
- 0779US5242862ASemiconductor device and method of manufacturing sameNIPPON DENSO CO·Filed 1991·Granted Sep 7, 1993·38 cites·14 claims
- 0874US5877527ASemiconductor device and method of producing the sameDENSO CORP·Filed 1997·Granted Mar 2, 1999·28 cites·12 claims
- 0970US6603173B1Vertical type MOSFETDENSO CORP·Filed 1999·Granted Aug 5, 2003·29 cites·23 claims
- 1067US6114207AMethod of producing a semiconductor deviceDENSO CORP·Filed 1999·Granted Sep 5, 2000·20 cites·9 claims
- 1165US5871659ADry etching process for semiconductorNIPPON DENSO CO·Filed 1996·Granted Feb 16, 1999·31 cites·18 claims
- 1264US6903417B2Power semiconductor deviceDENSO CORP·Filed 2003·Granted Jun 7, 2005·4 cites·5 claims
- 1364US6451645B1Method for manufacturing semiconductor device with power semiconductor element and diodeDENSO CORP·Filed 2001·Granted Sep 17, 2002·12 cites·17 claims
- 1463US6278155B1P-channel MOSFET semiconductor device having a low on resistanceDENSO CORP·Filed 1999·Granted Aug 21, 2001·17 cites·23 claims
- 1560US5663096AMethod of manufacturing a vertical semiconductor device with ground surface providing a reduced ON resistanceNIPPON DENSO CO·Filed 1995·Granted Sep 2, 1997·13 cites·8 claims
- 1656US9209538B2Memory card connectorKYOCERA CONNECTOR PROD CORP·Filed 2014·Granted Dec 8, 2015·4 cites·6 claims
- 1756US6949434B2Method of manufacturing a vertical semiconductor deviceDENSO CORP·Filed 2004·Granted Sep 27, 2005·2 cites·18 claims
- 1855US6974996B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2003·Granted Dec 13, 2005·7 cites·12 claims
- 1955US5798550AVertical type semiconductor device and gate structureNIPPON DENSO CO·Filed 1995·Granted Aug 25, 1998·17 cites·10 claims
- 2054US2005227438A1Semiconductor device and method of manufacturing sameDENSO CORP·Filed 2005·Application pending·0 cites
- 2151US5994187AMethod of manufacturing a vertical semiconductor deviceNIPPON DENSO CO·Filed 1997·Granted Nov 30, 1999·8 cites·32 claims
- 2248US10365317B2Semiconductor element test apparatus and semiconductor element test methodDENSO CORP·Filed 2016·Granted Jul 30, 2019·0 cites·14 claims
- 2347US6316300B1Method of manufacturing a semiconductor device having an oxidation process for selectively forming an oxide filmDENSO CORP·Filed 1999·Granted Nov 13, 2001·13 cites·20 claims
- 2447US2007104021A1Screw for plastication of resin material and a plasticizing mechanismAUTONETWORKS TECHNOLOGIES LTD·Filed 2004·Application pending·0 cites
- 2546US7064033B2Semiconductor device and method of manufacturing sameDENSO CORP·Filed 2004·Granted Jun 20, 2006·0 cites·9 claims
- 2646US6498366B1Semiconductor device that exhibits decreased contact resistance between substrate and drain electrodeDENSO CORP·Filed 1997·Granted Dec 24, 2002·6 cites·75 claims
- 2746US2007104822A1Plasticizing apparatus for resin materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Application pending·0 cites
- 2844US6649478B2Semiconductor device and method of manufacturing sameDENSO CORP·Filed 2002·Granted Nov 18, 2003·0 cites·5 claims
- 2941US6353196B2Water-resistant switching deviceALPS ELECTRIC CO LTD·Filed 2001·Granted Mar 5, 2002·2 cites·4 claims
- 3041US2015048510A1Semiconductor deviceDENSO CORP·Filed 2013·Application pending·0 cites
- 3141US2013039065A1Semiconductor light-emitting element mounting module, semiconductor light-emitting element module, manufacturing method of semiconductor light-emitting element mounting module, and manufacturing method of semiconductor light-emitting element moduleKYOCERA CONNECTOR PROD CORP·Filed 2012·Application pending·0 cites
- 3236US2015008478A1Semiconductor device and manufacturing method of the sameDENSO CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →