Inventor · disambiguated record
Yoshiaki Okuhama
Also filed as: OKUHAMA YOSHIAKI
10 granted patents·361 citations·filing 1983–2020
91Inventor score
Files withDAIWA FINE CHEMICALS CO LTD5MITSUBISHI MATERIALS CORP1NIPPON BEET SUGAR MFG1OBATA DOHI DAIWA FINE CHEMICAL1OBATA DONI DAIWA FINE CHEMICAL1
Top patents by PatentIndex Score
10 records- 0194US6183545B1Aqueous solutions for obtaining metals by reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted Feb 6, 2001·142 cites·12 claims
- 0292US4459185ATin, lead, and tin-lead alloy plating bathsOBATA DONI DAIWA FINE CHEMICAL·Filed 1983·Granted Jul 10, 1984·94 cites·26 claims
- 0378US12104326B2Decay-resistant paperNIPPON BEET SUGAR MFG·Filed 2020·Granted Oct 1, 2024·1 cites·3 claims
- 0477US6235093B1Aqueous solutions for obtaining noble metals by chemical reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted May 22, 2001·47 cites·4 claims
- 0573US5618404AElectrolytic process for producing lead sulfonate and tin sulfonate for solder plating useDAIWA FINE CHEMICALS CO LTD·Filed 1995·Granted Apr 8, 1997·29 cites·3 claims
- 0671US7166152B2Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the methodDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jan 23, 2007·13 cites·27 claims
- 0760US7056448B2Method for forming circuit patternDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jun 6, 2006·6 cites·17 claims
- 0856US4673470ATin, lead, or tin-lead alloy plating bathOBATA KEIGO·Filed 1986·Granted Jun 16, 1987·12 cites·10 claims
- 0946US5651873AElectroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surfaceMITSUBISHI MATERIALS CORP·Filed 1995·Granted Jul 29, 1997·14 cites·15 claims
- 1029US4555314ATin-lead alloy plating bathOBATA DOHI DAIWA FINE CHEMICAL·Filed 1984·Granted Nov 26, 1985·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →