Inventor · disambiguated record
Yoshihito Okuwaki
Also filed as: OKUWAKI YOSHIHITO
4 granted patents·4 pending applications·100 citations·filing 1998–2019
73Inventor score
Top patents by PatentIndex Score
8 records- 0190US6109507AMethod of forming solder bumps and method of forming preformed solder bumpsFUJITSU LTD·Filed 1998·Granted Aug 29, 2000·88 cites·8 claims
- 0274US8490000B2Program, method and system for selecting the three-dimensional model of a componentOKUWAKI YOSHIHITO·Filed 2008·Granted Jul 16, 2013·10 cites·17 claims
- 0354US8249833B2Apparatus and method for verifying model-design, and program thereofOKUWAKI YOSHIHITO·Filed 2006·Granted Aug 21, 2012·2 cites·7 claims
- 0445US2008076274A1Device design supporting method, program, and systemFUJITSU LTD·Filed 2007·Application pending·0 cites
- 0541US2014172367A1Interference check apparatus and methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 0639US2020075025A1Information processing apparatus and facilitation support methodFUJITSU LTD·Filed 2019·Application pending·0 cites
- 0737US9041710B2Support apparatus and design support method for differentiating between holes and projection graphicsOKUWAKI YOSHIHITO·Filed 2012·Granted May 26, 2015·0 cites·16 claims
- 0833US2011043525A1Drawing correction assisting apparatus, drawing correction assisting method, and storage mediumFUJITSU LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →