Inventor · disambiguated record
Yoshitomo Onitsuka
Also filed as: ONITSUKA YOSHITOMO
7 granted patents·1 pending application·1 citations·filing 2015–2022
69Inventor score
Technology areasH10W
Files withKYOCERA CORP8
Top patents by PatentIndex Score
8 records- 0178US12177983B2Electronic component housing package, electronic device, and electronic moduleKYOCERA CORP·Filed 2020·Granted Dec 24, 2024·1 cites·18 claims
- 0251US10945338B2Wiring substrateKYOCERA CORP·Filed 2019·Granted Mar 9, 2021·0 cites·6 claims
- 0350US2024213433A1Substrate, package, electronic component, and light emitting deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 0448US12009285B2Substrate having a recessed portion for an electronic componentKYOCERA CORP·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 0544US10499510B2Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrateKYOCERA CORP·Filed 2017·Granted Dec 3, 2019·0 cites·4 claims
- 0639US10182508B2Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing packageKYOCERA CORP·Filed 2015·Granted Jan 15, 2019·0 cites·11 claims
- 0736US11264967B2Multi-piece wiring substrate, electronic component housing package, electronic device, and electronic moduleKYOCERA CORP·Filed 2018·Granted Mar 1, 2022·0 cites·12 claims
- 0836US10991671B2Multi-piece wiring substrate, electronic component housing package, and electronic deviceKYOCERA CORP·Filed 2018·Granted Apr 27, 2021·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →