Inventor · disambiguated record
Yoshiharu Ono
Also filed as: ONO YOSHIHARU
11 granted patents·6 pending applications·65 citations·filing 2000–2022
87Inventor score
Files withKIOXIA CORP3MITSUBISHI ELECTRIC CORP3TOSHIBA MEMORY CORP3NIIGATA POWER SYSTEMS CO LTD2RENESAS ELECTRONICS CORP2
Top patents by PatentIndex Score
17 records- 0193US8092703B2Manufacturing method of semiconductor deviceISHIBASHI TAKEO·Filed 2007·Granted Jan 10, 2012·40 cites·18 claims
- 0284US10192741B2Device substrate, method of manufacturing device substrate, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Jan 29, 2019·3 cites·9 claims
- 0377US9793120B2Device substrate, method of manufacturing device substrate, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 17, 2017·2 cites·5 claims
- 0476US9153984B2Charging deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 6, 2015·5 cites·4 claims
- 0575US11164843B2Substrate bonding apparatusKIOXIA CORP·Filed 2020·Granted Nov 2, 2021·1 cites·20 claims
- 0660US6555790B1Semiconductor manufacturing apparatus, method for cleaning the semiconductor manufacturing apparatus, and light source unitMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 29, 2003·10 cites·11 claims
- 0751US7030007B2Via-filling material and process for fabricating semiconductor integrated circuit using the materialMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 18, 2006·3 cites·6 claims
- 0848US2015311729A1Charging deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0946US11282723B2Liquid delivery member, liquid delivery apparatus, and semiconductor device manufacturing methodKIOXIA CORP·Filed 2019·Granted Mar 22, 2022·0 cites·14 claims
- 1040US7066131B2Cylinder headNIIGATA POWER SYSTEMS CO LTD·Filed 2002·Granted Jun 27, 2006·1 cites·2 claims
- 1140US2023076961A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1240US2019244809A1Chemical liquid application apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 1337US2004248419A1Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1437US2003215752A1Device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1536US2004087138A1Method for manufacturing buried wiring structureRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1630US8671773B2Electronic flow meterONO YOSHIHARU·Filed 2012·Granted Mar 18, 2014·0 cites·6 claims
- 1730US7066164B2Engine, engine exhaust temperature controlling apparatus, and controlling methodNIIGATA POWER SYSTEMS CO LTD·Filed 2002·Granted Jun 27, 2006·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →