Inventor · disambiguated record
Yota Otani
Also filed as: OTANI YOTA
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Files withFURUKAWA ELECTRIC CO LTD3
Top patents by PatentIndex Score
3 records- 0158US2024084172A1Adhesive composition, film adhesive, and semiconductor package using film adhesive and producing method thereofFURUKAWA ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0252US2022367234A1Dicing die attach film and method of producing the same, and semiconductor package and method of producing the sameFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0352US2022310547A1Dicing die attach film and method of producing the same, and semiconductor package and method of producing the sameFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →