Inventor · disambiguated record
Yoshinobu Ozaki
Also filed as: OZAKI YOSHINOBU
19 granted patents·4 pending applications·56 citations·filing 2000–2024
91Inventor score
Top patents by PatentIndex Score
23 records- 0192US9120524B2Straddle type vehicleHONDA MOTOR CO LTD·Filed 2013·Granted Sep 1, 2015·11 cites·16 claims
- 0292US8839756B2Intake air routing device for an engine, and engine incorporating sameHONDA MOTOR CO LTD·Filed 2013·Granted Sep 23, 2014·16 cites·20 claims
- 0373US9150269B2Evaporation system for motorcycle, and motorcycle incorporating the sameOZAKI YOSHINOBU·Filed 2012·Granted Oct 6, 2015·4 cites·17 claims
- 0468US2024371832A1Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2024·Application pending·0 cites
- 0567US10227957B2Air cleaner structure in saddle-ride type vehicleHONDA MOTOR CO LTD·Filed 2017·Granted Mar 12, 2019·2 cites·9 claims
- 0667US8256386B2Saddle-ride vehicleWATANABE KENJI·Filed 2009·Granted Sep 4, 2012·5 cites·16 claims
- 0766US10100789B2Saddle-ride type vehicleHONDA MOTOR CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·10 claims
- 0865US7093569B2Power unit for saddle-ride type vehicleHONDA MOTOR CO LTD·Filed 2005·Granted Aug 22, 2006·9 cites·15 claims
- 0956US6607609B2Surface treatment methodSUZUKI MOTOR CO·Filed 2002·Granted Aug 19, 2003·2 cites·2 claims
- 1056US6569537B1Surface treatment method sliding member and pistonSUZUKI MOTOR CO·Filed 2000·Granted May 27, 2003·2 cites·3 claims
- 1153US12074139B2Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Aug 27, 2024·0 cites·4 claims
- 1252US6951691B2Surface treatment methodSUZUKI MOTOR CO·Filed 2003·Granted Oct 4, 2005·1 cites·6 claims
- 1351US8601993B2Engine balancer deviceKOYANAGI MASASHI·Filed 2009·Granted Dec 10, 2013·1 cites·7 claims
- 1450US10309355B2Saddle-ride type vehicleHONDA MOTOR CO LTD·Filed 2017·Granted Jun 4, 2019·0 cites·16 claims
- 1549US9556833B2MotorcycleHONDA MOTOR CO LTD·Filed 2014·Granted Jan 31, 2017·1 cites·15 claims
- 1648US2025226347A1Adhesive film for semiconductors, dicing die bonding film, and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 1748US2025226348A1Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 1844US2025006574A1Reinforced semiconductor chip production method, semiconductor chip with film, semiconductor chip reinforcement method, reinforcement film and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1943US11935870B2Method for manufacturing semiconductor device having dolmen structure, method for manufacturing support piece, and laminated filmRESONAC CORP·Filed 2020·Granted Mar 19, 2024·0 cites·15 claims
- 2042US12463190B2Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Nov 4, 2025·0 cites·20 claims
- 2141US12412880B2Semiconductor device having dolmen structure and method for manufacturing sameRESONAC CORP·Filed 2019·Granted Sep 9, 2025·0 cites·16 claims
- 2239US12482707B2Method of manufacturing semiconductor device and colletRESONAC CORP·Filed 2020·Granted Nov 25, 2025·0 cites·15 claims
- 2339US12451395B2Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2019·Granted Oct 21, 2025·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Yoshinobu Ozaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →