Inventor · disambiguated record
Youngwoo Park
Also filed as: PARK YOUNGWOO
82 granted patents·23 pending applications·497 citations·filing 2002–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD46SAMSUNG DISPLAY CO LTD20PARK JINTAEK11LEE JAEGOO6KANAMORI KOHJI3
Top patents by PatentIndex Score
105 records- 0197US8704288B2Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devicesLEE JAEGOO·Filed 2011·Granted Apr 22, 2014·40 cites·30 claims
- 0296US10229927B2Semiconductor device and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 12, 2019·18 cites·15 claims
- 0396US9685452B2Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having electrodes vertically stacked on the substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 20, 2017·25 cites·20 claims
- 0496US9595346B23-Dimensional semiconductor memory device and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 14, 2017·22 cites·20 claims
- 0596US9515087B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 6, 2016·32 cites·20 claims
- 0696US9362303B2Semiconductor memory devices including fine patterns and methods of fabricating the sameLEE JAEGOO·Filed 2015·Granted Jun 7, 2016·19 cites·18 claims
- 0796US9099347B2Three-dimensional semiconductor memory devices and method of fabricating the sameYUN JANG-GN·Filed 2012·Granted Aug 4, 2015·16 cites·15 claims
- 0895US11580914B2Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Feb 14, 2023·3 cites·26 claims
- 0995US9385139B2Three dimensional semiconductor memory devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 5, 2016·13 cites·17 claims
- 1095US8741761B2Methods of manufacturing three-dimensional semiconductor devicesLEE JAEGOO·Filed 2011·Granted Jun 3, 2014·28 cites·18 claims
- 1194US11625119B2Display device including an input sensor having a corner areaSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Apr 11, 2023·3 cites·23 claims
- 1294US9437483B2Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 6, 2016·16 cites·23 claims
- 1393US8822322B2Semiconductor devices and methods of fabricating the sameLEE JAEGOO·Filed 2011·Granted Sep 2, 2014·15 cites·16 claims
- 1492US11812651B2Flexible display device with anti-reflection layer and method for manufacturing sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Nov 7, 2023·2 cites·19 claims
- 1592US10002877B2Three-dimensional semiconductor devices and fabricating methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 19, 2018·8 cites·13 claims
- 1692US9019739B2Three-dimensional semiconductor devices and methods of fabricating the samePARK JINTAEK·Filed 2014·Granted Apr 28, 2015·14 cites·23 claims
- 1791US11183466B2Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 23, 2021·4 cites·9 claims
- 1891US9337207B2Semiconductor devices including word line interconnecting structuresPARK JINTAEK·Filed 2014·Granted May 10, 2016·14 cites·12 claims
- 1991US8530959B2Three-dimensional semiconductor memory deviceCHANG SUNG-IL·Filed 2011·Granted Sep 10, 2013·11 cites·10 claims
- 2090US12217706B2Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·22 claims
- 2190US10032789B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·10 cites·23 claims
- 2290US9875931B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2016·Granted Jan 23, 2018·7 cites·11 claims
- 2390US9362226B2Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devicesLEE JAEGOO·Filed 2015·Granted Jun 7, 2016·7 cites·20 claims
- 2490US8822971B2Semiconductor memory device having three-dimensionally arranged resistive memory cellsPARK JINTAEK·Filed 2012·Granted Sep 2, 2014·12 cites·23 claims
- 2589US11621233B2Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·12 claims
- 2689US10096616B2Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having electrodes vertically stacked on the substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 9, 2018·6 cites·15 claims
- 2789US10056404B2Semiconductor memory devices having closely spaced bit linesLEE JAEDUK·Filed 2016·Granted Aug 21, 2018·8 cites·17 claims
- 2889US8796091B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 5, 2014·9 cites·7 claims
- 2989US8379456B2Nonvolatile memory devices having dummy cell and bias methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 19, 2013·14 cites·19 claims
- 3088US9837429B2Method of fabricating a three-dimensional semiconductor memory device having a plurality of memory blocks on a peripheral logic structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 5, 2017·5 cites·10 claims
- 3188US9559112B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 31, 2017·8 cites·20 claims
- 3288US9183893B2Semiconductor memory deviceKANAMORI KOHJI·Filed 2013·Granted Nov 10, 2015·11 cites·20 claims
- 3387US9595333B2Nonvolatile memory device and programming method thereofSIM JAESUNG·Filed 2015·Granted Mar 14, 2017·10 cites·23 claims
- 3487US8735860B2Variable resistance memory device and method of fabricating the samePARK JINTAEK·Filed 2013·Granted May 27, 2014·9 cites·9 claims
- 3585US9847346B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 19, 2017·5 cites·20 claims
- 3684US9142563B2Three dimensional semiconductor memory devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 22, 2015·3 cites·6 claims
- 3784US2024203903A1Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3883US10332902B2Three-dimensional semiconductor memory device including vertically stacked electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·3 cites·20 claims
- 3983US9960171B2Semiconductor devices including charge storage patternsKANAMORI KOHJI·Filed 2016·Granted May 1, 2018·4 cites·15 claims
- 4082US11942437B2Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 26, 2024·0 cites·16 claims
- 4182US9601204B2Three-dimensional semiconductor devices and fabricating methods thereofPARK JINTAEK·Filed 2014·Granted Mar 21, 2017·5 cites·23 claims
- 4281US9865685B2Three-dimensional semiconductor memory devices including a vertical channelSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 9, 2018·2 cites·19 claims
- 4381US9768193B2Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 19, 2017·3 cites·19 claims
- 4481US9224429B2Three-dimensional semiconductor devices and methods of fabricating the samePARK JINTAEK·Filed 2015·Granted Dec 29, 2015·5 cites·18 claims
- 4581US8643080B2Three-dimensional semiconductor memory deviceLEE CHANGHYUN·Filed 2011·Granted Feb 4, 2014·6 cites·19 claims
- 4681US2024423050A1Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4780US8742488B2Three-dimensional semiconductor memory devices and methods of fabricating the sameLEE JAEGOO·Filed 2012·Granted Jun 3, 2014·5 cites·19 claims
- 4879US10418278B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2017·Granted Sep 17, 2019·2 cites·20 claims
- 4979US9343476B2Semiconductor devices and methods of fabricating the sameSEO YUJEONG·Filed 2014·Granted May 17, 2016·6 cites·13 claims
- 5079US2025167133A1Semiconductor package including an electromagnetic shield and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →