Inventor · disambiguated record
Yoshihiro Saeki
Also filed as: SAEKI YOSHIHIRO
26 granted patents·6 pending applications·282 citations·filing 2001–2024
96Inventor score
Files withOKI ELECTRIC IND CO LTD10OKI SEMICONDUCTOR CO LTD7SAEKI YOSHIHIRO5MICRON TECHNOLOGY INC2TOYOTA MOTOR CO LTD2
Top patents by PatentIndex Score
32 records- 0194US6787915B2Rearrangement sheet, semiconductor device and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2001·Granted Sep 7, 2004·81 cites·30 claims
- 0290US7662671B2Semiconductor device and method for manufacturing the sameOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Feb 16, 2010·22 cites·4 claims
- 0389US7514796B2Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chipsOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Apr 7, 2009·16 cites·14 claims
- 0488US11628789B2Occupant position detection systemTOYOTA MOTOR CO LTD·Filed 2020·Granted Apr 18, 2023·4 cites·5 claims
- 0587US7459348B2Method for manufacturing a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Dec 2, 2008·15 cites·7 claims
- 0687US7372137B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2006·Granted May 13, 2008·16 cites·19 claims
- 0782US7132752B2Semiconductor chip and semiconductor device including lamination of semiconductor chipsOKI ELECTRIC IND CO LTD·Filed 2004·Granted Nov 7, 2006·29 cites·10 claims
- 0881US7804161B2Semiconductor device and dam for resinOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Sep 28, 2010·8 cites·10 claims
- 0981US6717252B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Apr 6, 2004·32 cites·20 claims
- 1078US7679175B2Semiconductor device including substrate and upper plate having reduced warpageOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Mar 16, 2010·8 cites·6 claims
- 1176US7299696B2Acceleration sensor chip packageOKI ELECTRIC IND CO LTD·Filed 2005·Granted Nov 27, 2007·6 cites·18 claims
- 1275US11318812B2Temperature environment regulating system, temperature preference estimating system, and non-transitory computer-readable mediumTOYOTA MOTOR CO LTD·Filed 2020·Granted May 3, 2022·1 cites·6 claims
- 1374US7614301B2Acceleration sensor chip package and method of producing the sameOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Nov 10, 2009·5 cites·19 claims
- 1473US8541891B2Semiconductor deviceSAEKI YOSHIHIRO·Filed 2008·Granted Sep 24, 2013·6 cites·18 claims
- 1572US8484820B2Semiconductor device fabricating method and fabricating apparatusSAEKI YOSHIHIRO·Filed 2011·Granted Jul 16, 2013·3 cites·11 claims
- 1671US6836010B2Semiconductor device include relay chip connecting semiconductor chip pads to external padsOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 28, 2004·18 cites·18 claims
- 1769US9543204B2Method for manufacturing semiconductor deviceSAEKI YOSHIHIRO·Filed 2012·Granted Jan 10, 2017·4 cites·15 claims
- 1868US8329561B2Method of producing semiconductor deviceSAEKI YOSHIHIRO·Filed 2010·Granted Dec 11, 2012·2 cites·10 claims
- 1967US8432025B2Semiconductor device and plurality of damsSAEKI YOSHIHIRO·Filed 2010·Granted Apr 30, 2013·2 cites·9 claims
- 2059US2024306405A1Semiconductor storage deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2158US8003437B2Semiconductor device fabricating method and fabricating apparatusOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Aug 23, 2011·1 cites·9 claims
- 2256US8475337B2Vehicle heat management deviceISHIKAWA MASAHIDE·Filed 2009·Granted Jul 2, 2013·1 cites·7 claims
- 2355US11257744B2Method of forming vias using silicon on insulator substrateMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 22, 2022·0 cites·16 claims
- 2452US2009031563A1Rearrangement sheet, semiconductor device and method of manufacturing thereofUCHIDA YASUFUMI·Filed 2008·Application pending·0 cites
- 2548US10418311B2Method of forming vias using silicon on insulator substrateMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 17, 2019·0 cites·11 claims
- 2648US7435626B2Rearrangement sheet, semiconductor device and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 14, 2008·2 cites·20 claims
- 2745US11201132B2Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatusSHINKAWA KK·Filed 2018·Granted Dec 14, 2021·0 cites·9 claims
- 2844US2005200363A1Electrical inspection method and apparatus for printed wiring board for the electronic component mounting, and computer-readable recording mediumMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 2944US2007068454A1Jig for manufacturing semiconductor devices and method for manufacturing the jigOKI ELECTRIC IND CO LTD·Filed 2006·Application pending·0 cites
- 3040US2011169376A1Piezoelectric ActuatorYONETAKE JUNICHIRO·Filed 2009·Application pending·0 cites
- 3140US2006207086A1Method for laminating chips and method for manufacturing semiconductor device using the sameOKI ELECTRIC IND CO LTD·Filed 2006·Application pending·0 cites
- 3230US7492038B2Semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2004·Granted Feb 17, 2009·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →