Inventor · disambiguated record
Yoshihisa Saimoto
Also filed as: SAIMOTO YOSHIHISA
6 granted patents·6 pending applications·64 citations·filing 2001–2018
79Inventor score
Top patents by PatentIndex Score
12 records- 0179US7201969B2Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the filmMITSUI CHEMICALS INC·Filed 2003·Granted Apr 10, 2007·26 cites·4 claims
- 0275US6730595B2Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said methodMITSUI CHEMICALS INC·Filed 2001·Granted May 4, 2004·24 cites·5 claims
- 0368US6879026B2Surface protecting adhesive film for semiconductor wafer and processing method for semiconductor wafer using said adhesive filmMITSUI CHEMICALS INC·Filed 2003·Granted Apr 12, 2005·13 cites·12 claims
- 0458US7501312B2Method of protecting semiconductor wafer and adhesive film for protection of semiconductor waferMITSUI CHEMICALS INC·Filed 2005·Granted Mar 10, 2009·1 cites·6 claims
- 0538US8476740B2Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheetHAYASHISHITA EIJI·Filed 2011·Granted Jul 2, 2013·0 cites·15 claims
- 0638US2006257754A1Pellicles having low adhesive residueMITSUI CHEMICALS INC·Filed 2006·Application pending·0 cites
- 0738US2008020575A1Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheetMITSUI CHEMICALS INC·Filed 2007·Application pending·0 cites
- 0836US2007167003A1Adhesive film and method for forming metal film using sameMITSUI CHEMICALS INC·Filed 2004·Application pending·0 cites
- 0935US7238421B2Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive filmMITSUI CHEMICALS INC·Filed 2003·Granted Jul 3, 2007·0 cites·4 claims
- 1035US2005244631A1Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the sameMITSUI CHEMICALS INC·Filed 2005·Application pending·0 cites
- 1134US2018337083A1Method of processing substrateSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1233US2003064579A1Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive filmFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →