Inventor · disambiguated record
Yoshitsugu Sakamoto
Also filed as: SAKAMOTO YOSHITSUGU
18 granted patents·6 pending applications·224 citations·filing 1987–2024
94Inventor score
Files withDENSO CORP15NEOMAX MATERIALS CO LTD2SENJU METAL INDUSTRY CO2DAIKIN MFG CO LTD1HIRANO NAOHIKO1
Top patents by PatentIndex Score
24 records- 0191US7793820B2Solder preform and a process for its manufactureSENJU METAL INDUSTRY CO·Filed 2008·Granted Sep 14, 2010·31 cites·19 claims
- 0284US7800230B2Solder preform and electronic componentDENSO CORP·Filed 2007·Granted Sep 21, 2010·12 cites·4 claims
- 0383US6087044ACarbon electrode for secondary cells, a method for making the same, and a nonaqueous electrolyte secondary cell comprising the carbon electrodeDENSO CORP·Filed 1997·Granted Jul 11, 2000·45 cites·27 claims
- 0481US4867641AOuter wall structure of a torque converter and othersDAIKIN MFG CO LTD·Filed 1987·Granted Sep 19, 1989·37 cites·3 claims
- 0580US2025125214A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0680US2025118623A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0778US7235876B2Semiconductor device having metallic plate with grooveDENSO CORP·Filed 2006·Granted Jun 26, 2007·8 cites·8 claims
- 0877US11710709B2Terminal member made of plurality of metal layers between two heat sinksDENSO CORP·Filed 2021·Granted Jul 25, 2023·1 cites·10 claims
- 0975US10081852B2Solder preform and a process for its manufactureHIRANO NAOHIKO·Filed 2010·Granted Sep 25, 2018·2 cites·14 claims
- 1075US7215020B2Semiconductor device having metal plates and semiconductor chipDENSO CORP·Filed 2004·Granted May 8, 2007·22 cites·8 claims
- 1175US2024071861A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1270US7601625B2Method for manufacturing semiconductor device having solder layerDENSO CORP·Filed 2005·Granted Oct 13, 2009·5 cites·12 claims
- 1366US6242838B1Commutator and method of manufacturing the sameDENSO CORP·Filed 1999·Granted Jun 5, 2001·25 cites·11 claims
- 1464US8029918B2Brazing method and brazed structureNEOMAX MATERIALS CO LTD·Filed 2010·Granted Oct 4, 2011·2 cites·6 claims
- 1563US12506045B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Dec 23, 2025·0 cites·4 claims
- 1659US6121590ACeramic-metal junction structure and a method for manufacturing the sameDENSO CORP·Filed 1999·Granted Sep 19, 2000·13 cites·11 claims
- 1754US8896119B2Bonding material for semiconductor devicesSAKAMOTO YOSHITSUGU·Filed 2011·Granted Nov 25, 2014·1 cites·11 claims
- 1850US7193326B2Mold type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 20, 2007·3 cites·23 claims
- 1949US7468318B2Method for manufacturing mold type semiconductor deviceDENSO CORP·Filed 2007·Granted Dec 23, 2008·0 cites·5 claims
- 2049US6118110ACeramic-metal junction structure and a method for manufacturing the sameDENSO CORP·Filed 1999·Granted Sep 12, 2000·8 cites·10 claims
- 2138US2007148490A1Brazing method and brazed structureNEOMAX MATERIALS CO LTD·Filed 2004·Application pending·0 cites
- 2237US2015027589A1Solder PasteSENJU METAL INDUSTRY CO·Filed 2012·Application pending·0 cites
- 2335US5614291ASemiconductor device and method of manufacturing the sameNIPPON DENSO CO·Filed 1995·Granted Mar 25, 1997·9 cites·25 claims
- 2431US2001047861A1Brazing method, brazement, method of production of corrosion-resistant heat exchanger, and corrosion-resistant heat exchangerFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →