Inventor · disambiguated record
Yoshiaki Sakaniwa
Also filed as: SAKANIWA YOSHIAKI
5 granted patents·3 pending applications·2 citations·filing 2019–2022
62Inventor score
Files withMITSUBISHI MATERIALS CORP8
Top patents by PatentIndex Score
8 records- 0170US11222835B2Insulating circuit substrate and method for producing insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jan 11, 2022·2 cites·19 claims
- 0251US12177962B2Insulating resin circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Granted Dec 24, 2024·0 cites·8 claims
- 0349US12068219B2Heat sink integrated insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 0449US2025193993A1Insulated circuit board with integrated heat sink, and electronic deviceMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0548US12133338B2Insulated circuit substrate manufacturing methodMITSUBISHI MATERIALS CORP·Filed 2021·Granted Oct 29, 2024·0 cites·7 claims
- 0646US12108528B2Insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2020·Granted Oct 1, 2024·0 cites·3 claims
- 0743US2023207333A1Manufacturing method for insulating resin circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 0843US2023411266A1Heatsink-integrated insulating circuit board and method for manufacturing heatsink-integrated insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshiaki Sakaniwa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →