Inventor · disambiguated record
Yoshiki Sakuma
Also filed as: SAKUMA YOSHIKI
12 granted patents·1 pending application·652 citations·filing 1992–2002
93Inventor score
Files withFUJITSU LTD13
Top patents by PatentIndex Score
13 records- 0194US5270247AAtomic layer epitaxy of compound semiconductorFUJITSU LTD·Filed 1992·Granted Dec 14, 1993·206 cites·12 claims
- 0293US6011271ASemiconductor device and method of fabricating the sameFUJITSU LTD·Filed 1996·Granted Jan 4, 2000·147 cites·35 claims
- 0389US6235547B1Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 1999·Granted May 22, 2001·93 cites·24 claims
- 0488US5438018AMethod of making semiconductor device by selective epitaxial growthFUJITSU LTD·Filed 1993·Granted Aug 1, 1995·98 cites·15 claims
- 0579US6459107B2Photodetector having a mixed crystal layer of SiGeCFUJITSU LTD·Filed 2001·Granted Oct 1, 2002·24 cites·7 claims
- 0668US5574308ASemiconductor device and its manufacturing methodFUJITSU LTD·Filed 1995·Granted Nov 12, 1996·31 cites·15 claims
- 0764US5656821AQuantum semiconductor device with triangular etch pitFUJITSU LTD·Filed 1995·Granted Aug 12, 1997·20 cites·8 claims
- 0862US6777728B2Semiconductor device and complementary semiconductor deviceFUJITSU LTD·Filed 2002·Granted Aug 17, 2004·10 cites·14 claims
- 0944US5296088ACompound semiconductor crystal growing methodFUJITSU LTD·Filed 1992·Granted Mar 22, 1994·6 cites·15 claims
- 1039US5922621AQuantum semiconductor device and a fabrication process thereofFUJITSU LTD·Filed 1997·Granted Jul 13, 1999·5 cites·12 claims
- 1138US5429068ADeposition method for compound semiconductor forming deviceFUJITSU LTD·Filed 1993·Granted Jul 4, 1995·8 cites·10 claims
- 1235US5503105ADeposition method for compound semiconductor forming semiconductor deviceFUJITSU LTD·Filed 1995·Granted Apr 2, 1996·4 cites·6 claims
- 1333US2002020851A1Heterobipolar transistor and a method of forming a SiGeC mixed crystal layerFUJITSU LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →