Inventor · disambiguated record
Yoshiki Seike
Also filed as: SEIKE YOSHIKI
4 granted patents·10 pending applications·0 citations·filing 2017–2023
54Inventor score
Files withTOKUYAMA CORP14
Top patents by PatentIndex Score
14 records- 0171US12269980B2Silicon etching solution and method for producing silicon device using the etching solutionTOKUYAMA CORP·Filed 2022·Granted Apr 8, 2025·0 cites·7 claims
- 0261US11466206B2Silicon etching solution and method for producing silicon device using the etching solutionTOKUYAMA CORP·Filed 2020·Granted Oct 11, 2022·0 cites·8 claims
- 0354US2024170293A1Silicon Etching Solution, Method for Treating Substrate, and Method for Manufacturing Silicon DeviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 0454US2024254389A1Silicon etching solution, method of treating silicon substrate, and method of manufacturing semiconductor deviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 0554US2024170294A1Silicon Etching Solution, Method for Treating Substrate, and Method for Manufacturing Silicon DeviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 0653US2024067878A1Silicon etching solution and method for producing silicon etching solution, method for treating substrate, and method for producing silicon deviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 0748US12466999B2Silicon etching liquid, and method for producing silicon device and method for processing silicon substrate, each using said etching liquidTOKUYAMA CORP·Filed 2021·Granted Nov 11, 2025·0 cites·6 claims
- 0847US2023136986A1Silicon etching liquid containing aromatic aldehydeTOKUYAMA CORP·Filed 2022·Application pending·0 cites
- 0944US2024124775A1Silicon etching liquid, and method for producing silicon devices and method for processing substrates, each using said etching liquidTOKUYAMA CORP·Filed 2021·Application pending·0 cites
- 1043US2021269716A1Silicon Etching Solution, Method for Manufacturing Silicon Device Using Same, and Substrate Treatment MethodTOKUYAMA CORP·Filed 2021·Application pending·0 cites
- 1142US2023287270A1Silicon etching liquid, and method for producing silicon device and method for processing silicon substrate, each using said etching liquidTOKUYAMA CORP·Filed 2021·Application pending·0 cites
- 1242US2024112917A1Method for processing substrate, and method for manufacturing silicon device comprising said processing methodTOKUYAMA CORP·Filed 2022·Application pending·0 cites
- 1338US10689349B2Method for producing intermediate of biotin and method for producing biotinTOKUYAMA CORP·Filed 2017·Granted Jun 23, 2020·0 cites·13 claims
- 1438US2022041931A1Silicon Etching LiquidTOKUYAMA CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →