Inventor · disambiguated record
Yoko Shibasaki
Also filed as: SHIBASAKI YOKO
6 granted patents·4 pending applications·8 citations·filing 2007–2020
70Inventor score
Top patents by PatentIndex Score
10 records- 0161US8101336B2Photocurable and thermosetting resin composition, cured product thereof, and printed circuit boardITOH NOBUHITO·Filed 2008·Granted Jan 24, 2012·2 cites·13 claims
- 0258US12351686B2Curable resin composition, dry film and cured product of same, and electronic component containing said cured productTAIYO HOLDINGS CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·20 claims
- 0357US8048613B2Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the sameTAIYO INK MFG CO LTD·Filed 2008·Granted Nov 1, 2011·6 cites·24 claims
- 0455US12291604B2Curable resin composition, dry film and cured product thereof, and electronic component including cured productTAIYO HOLDINGS CO LTD·Filed 2020·Granted May 6, 2025·0 cites·20 claims
- 0544US7838197B2Photosensitive compositionTAIYO INK MFG CO LTD·Filed 2007·Granted Nov 23, 2010·0 cites·9 claims
- 0643US2009029181A1Photocurable and thermosetting resin composition, cured product thereof, and printed wiring board obtained by using the sameSHIBASAKI YOKO·Filed 2008·Application pending·0 cites
- 0742US2008096133A1Photocurable and thermosetting resin composition, cured product thereof and printed circuit board obtained using the sameKATO KENJI·Filed 2007·Application pending·0 cites
- 0841US2009194319A1Photocurable resin composition, dry film, cured product, and printed circuit boardITOH NOBUHITO·Filed 2009·Application pending·0 cites
- 0933US2013260109A1Photocurable resin composition, dry film, cured product and printed wiring boardTAIYO INK MFG CO LTD·Filed 2013·Application pending·0 cites
- 1028US8748502B2Photocurable resin compositionSHIBASAKI YOKO·Filed 2010·Granted Jun 10, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →