Inventor · disambiguated record
Yoshihiko Shimanuki
Also filed as: SHIMANUKI YOSHIHIKO
34 granted patents·5 pending applications·252 citations·filing 2001–2018
97Inventor score
Files withRENESAS TECH CORP14RENESAS ELECTRONICS CORP13SHIMANUKI YOSHIHIKO6RENESAS NTHN JP SEMICONDUCTOR3HITACHI LTD1
Top patents by PatentIndex Score
39 records- 0192US7566969B2Semiconductor device with improved arrangement of a through-hole in a wiring substrateRENESAS TECH CORP·Filed 2006·Granted Jul 28, 2009·27 cites·12 claims
- 0292US7459347B2Manufacturing method of a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Dec 2, 2008·20 cites·4 claims
- 0386US6927096B2Method of manufacturing a semiconductor deviceRENESAS NTHN JP SEMICONDUCTOR·Filed 2003·Granted Aug 9, 2005·45 cites·36 claims
- 0485US7371613B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted May 13, 2008·11 cites·18 claims
- 0582US7804159B2Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2004·Granted Sep 28, 2010·19 cites·7 claims
- 0682US7518250B2Semiconductor device and a method for manufacturing of the sameRENESAS TECH CORP·Filed 2005·Granted Apr 14, 2009·11 cites·9 claims
- 0782US7407834B2Manufacturing method of a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Aug 5, 2008·26 cites·4 claims
- 0882US7408252B2Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Granted Aug 5, 2008·8 cites·8 claims
- 0979US7176557B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Feb 13, 2007·7 cites·23 claims
- 1077US9831129B2Semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·2 cites·14 claims
- 1177US8969138B2Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceSHIMANUKI YOSHIHIKO·Filed 2013·Granted Mar 3, 2015·2 cites·12 claims
- 1277US7843049B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 30, 2010·5 cites·10 claims
- 1376US9812388B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 7, 2017·2 cites·17 claims
- 1476US8637965B2Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceSHIMANUKI YOSHIHIKO·Filed 2012·Granted Jan 28, 2014·2 cites·10 claims
- 1575US7339261B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 4, 2008·5 cites·13 claims
- 1671US8390133B2Semiconductor device and manufacturing method thereofSHIMANUKI YOSHIHIKO·Filed 2012·Granted Mar 5, 2013·2 cites·9 claims
- 1771US8222720B2Semiconductor device and manufacturing method thereofSHIMANUKI YOSHIHIKO·Filed 2010·Granted Jul 17, 2012·2 cites·7 claims
- 1871US7889513B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted Feb 15, 2011·3 cites·6 claims
- 1971US7821119B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 26, 2010·2 cites·9 claims
- 2071US7078824B2Semiconductor device having a switch circuitRENESAS NTHN JP SEMICONDUCTOR·Filed 2005·Granted Jul 18, 2006·6 cites·8 claims
- 2170US7777312B2Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Aug 17, 2010·2 cites·24 claims
- 2270US6700193B2Semiconductor package with elevated tubRENESAS TECH CORP·Filed 2001·Granted Mar 2, 2004·14 cites·2 claims
- 2369US8115298B2Semiconductor deviceSHIMANUKI YOSHIHIKO·Filed 2010·Granted Feb 14, 2012·1 cites·14 claims
- 2460US7525184B2Semiconductor device and its manufacturing methodRENESAS TECH CORP·Filed 2003·Granted Apr 28, 2009·6 cites·32 claims
- 2560US7470567B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Dec 30, 2008·1 cites·2 claims
- 2660US6930380B2Semiconductor deviceRENESAS NTHN JP SEMICONDUCTOR·Filed 2004·Granted Aug 16, 2005·10 cites·11 claims
- 2759US10515934B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Dec 24, 2019·0 cites·19 claims
- 2858US9484288B2Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 1, 2016·0 cites·30 claims
- 2958US7335529B2Manufacturing method of a semiconductor device utilizing a flexible adhesive tapeRENESAS TECH CORP·Filed 2003·Granted Feb 26, 2008·8 cites·17 claims
- 3058US2016276253A1Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3156US7803658B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 28, 2010·0 cites·5 claims
- 3254US7576422B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Aug 18, 2009·0 cites·5 claims
- 3353US9991229B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 5, 2018·0 cites·14 claims
- 3451US10090237B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 2, 2018·0 cites·11 claims
- 3550US2011159644A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 3648US6943064B2Method of manufacturing a semiconductor package with elevated tubHITACHI YONEZAWA ELECTRONICS·Filed 2004·Granted Sep 13, 2005·3 cites·7 claims
- 3743US2007194435A1Semiconductor device and method of manufacturing the sameSHIMANUKI YOSHIHIKO·Filed 2006·Application pending·0 cites
- 3841US2003001249A1Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor deviceFiled 2002·Application pending·0 cites
- 3940US2002168796A1Manufacturing method of a semiconductor deviceHITACHI LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →