Inventor · disambiguated record
Yoshiaki Shimooka
Also filed as: SHIMOOKA YOSHIAKI
25 granted patents·12 pending applications·249 citations·filing 2000–2023
95Inventor score
Files withTOSHIBA KK22SHIMOOKA YOSHIAKI5TOSHIBA AMERICA ELECTRONIC4KOJIMA AKIHIRO2NUFLARE TECHNOLOGY INC1
Top patents by PatentIndex Score
37 records- 0198US7786589B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 31, 2010·93 cites·17 claims
- 0292US7574090B2Semiconductor device using buried oxide layer as optical wave guidesTOSHIBA AMERICA ELECTRONIC·Filed 2006·Granted Aug 11, 2009·29 cites·20 claims
- 0385US8921997B2Electrical component and method of manufacturing the sameSHIMOOKA YOSHIAKI·Filed 2011·Granted Dec 30, 2014·8 cites·17 claims
- 0483US8309858B2Electrical device including a functional element in a cavityKOJIMA AKIHIRO·Filed 2009·Granted Nov 13, 2012·8 cites·26 claims
- 0581US7972887B2Micro-electro-mechanical-system package and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Jul 5, 2011·7 cites·18 claims
- 0680US6781236B2Semiconductor device using a multilayer wiring structureTOSHIBA KK·Filed 2002·Granted Aug 24, 2004·30 cites·11 claims
- 0780US6534870B1Apparatus and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Mar 18, 2003·32 cites·18 claims
- 0876US6563218B2Semiconductor device of multi-wiring structure and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted May 13, 2003·19 cites·11 claims
- 0972US7902068B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 8, 2011·5 cites·21 claims
- 1068US6750138B2Semiconductor device of multi-wiring structure and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Jun 15, 2004·12 cites·8 claims
- 1167US9181081B2Electrical component and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Nov 10, 2015·2 cites·17 claims
- 1266US9676608B2Electrical device including a functional element in a cavityTOSHIBA KK·Filed 2014·Granted Jun 13, 2017·1 cites·37 claims
- 1365US8829359B2Electrical device including a functional element in a cavityKOJIMA AKIHIRO·Filed 2012·Granted Sep 9, 2014·1 cites·28 claims
- 1463US12347641B2Charged particle beam pattern forming device and charged particle beam apparatusTOSHIBA KK·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1563US8921951B2MEMS device and manufacturing method thereofSHIMOOKA YOSHIAKI·Filed 2010·Granted Dec 30, 2014·1 cites·20 claims
- 1662US7589014B2Semiconductor device having multiple wiring layers and method of producing the sameTOSHIBA KK·Filed 2006·Granted Sep 15, 2009·1 cites·6 claims
- 1758US2024321797A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1856US7855141B2Semiconductor device having multiple wiring layers and method of producing the sameTOSHIBA KK·Filed 2009·Granted Dec 21, 2010·0 cites·6 claims
- 1956US7745326B2Semiconductor device having multiple wiring layers and method of producing the sameTOSHIBA KK·Filed 2009·Granted Jun 29, 2010·0 cites·8 claims
- 2055US11721520B2Semiconductor device, multi-charged-particle beam writing apparatus, and multi-charged-particle beam exposure apparatusNUFLARE TECHNOLOGY INC·Filed 2022·Granted Aug 8, 2023·0 cites·15 claims
- 2154US7768134B2Interconnect structure and method for semiconductor deviceTOSHIBA AMERICA ELECTRONIC·Filed 2009·Granted Aug 3, 2010·0 cites·17 claims
- 2252US9230744B2MEMS device and method of manufacturing the sameWATANABE KEI·Filed 2012·Granted Jan 5, 2016·0 cites·13 claims
- 2350US8867875B2Semiconductor device using buried oxide layer as optical wave guidesSHIMOOKA YOSHIAKI·Filed 2009·Granted Oct 21, 2014·0 cites·17 claims
- 2449US7524758B2Interconnect structure and method for semiconductor deviceTOSHIBA AMERICA ELECTRONIC·Filed 2006·Granted Apr 28, 2009·0 cites·17 claims
- 2548US9202654B2MEMS device and manufacturing method thereofTOSHIBA KK·Filed 2013·Granted Dec 1, 2015·0 cites·19 claims
- 2643US2004157443A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2004·Application pending·0 cites
- 2742US2007246830A1Long-lifetime interconnect structure and method for makingTOSHIBA AMERICA ELECTRONIC·Filed 2006·Application pending·0 cites
- 2841US8987829B2Semiconductor deviceSHIMOOKA YOSHIAKI·Filed 2008·Granted Mar 24, 2015·0 cites·11 claims
- 2941US2013249064A1Stacked package and method of manufacturing stacked packageYAMAZAKI HIROAKI·Filed 2012·Application pending·0 cites
- 3040US2002187625A1Semiconductor device have multiple wiring layers and method of producing the sameTOSHIBA KK·Filed 2002·Application pending·0 cites
- 3140US2002081839A1Semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 3240US2015259192A1Mems device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3337US2017057811A1DeviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 3437US2011291167A1Semiconductor deviceSHIMOOKA YOSHIAKI·Filed 2011·Application pending·0 cites
- 3536US2011241135A1Mems elementTOSHIBA KK·Filed 2011·Application pending·0 cites
- 3636US2011095382A1Mems deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3735US2015344298A1Electronic component and manufacturing method of the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →