Inventor · disambiguated record

Younhwan Shin

Also filed as: SHIN YOUNHWAN

1 granted patent·2 pending applications·0 citations·filing 2022–2024

9Inventor score

Technology areasH10P

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0152US12208541B2Dicing blade including diamond particlesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
0249US2025029864A1Chuck table and semiconductor package manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0340US2024091968A1Blade for sawing a panel level package and method of sawing a panel level package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →