Inventor · disambiguated record
Yongmoo Shin
Also filed as: SHIN YONGMOO
2 granted patents·16 pending applications·0 citations·filing 2022–2025
26Inventor score
Top patents by PatentIndex Score
18 records- 0171US2025357253A1Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIMSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0265US12400929B2Semiconductor device and method of forming graphene-coated core embedded within TIMSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 26, 2025·0 cites·24 claims
- 0356US2024404911A1Semiconductor package with improved heat dissipationJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0455US2024332114A1Semiconductor device with improved heat dissipation and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0554US2025079380A1Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light IrradiationSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0653US12431422B2Semiconductor device and method of forming RDL with graphene-coated coreSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 30, 2025·0 cites·32 claims
- 0753US2025118599A1Semiconductor Device and Method of Forming Embedded Trace Substrate with Barrier Layer to Inhibit ElectromigrationJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 0852US2025038058A1Semiconductor Device and Method of Forming an Antenna-in-Package StructureJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 0952US2025226345A1Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core ShellsSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1049US2025273590A1Semiconductor Device and Method of Forming EMI Shielding Material in Two-Step Process Using Light SinteringJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 1148US2024194629A1Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die AttachSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1248US2025022792A1Semiconductor Device and Method of Making Redistribution Layers with Intensive Pulsed Light IrradiationSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1348US2024413095A1Semiconductor Device and Method of Making an EMI Shield Using Intensive Pulsed Light IrradiationSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1447US2024332035A1Semiconductor Device and Method of Forming Interconnect Structure with Graphene Core Shells for 3D Stacking PackageSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1547US2024321768A1Semiconductor Device and Method of Partial Shielding with Embedded Graphene Core ShellsSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1646US2024194628A1Semiconductor Device and Method of Die Attach with Adhesive Layer Containing Graphene-Coated CoreSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 1740US2023260881A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1838US2025246505A1Semiconductor package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →