Inventor · disambiguated record
Yoshimichi Sogawa
Also filed as: SOGAWA YOSHIMICHI
7 granted patents·6 pending applications·150 citations·filing 2003–2013
86Inventor score
Top patents by PatentIndex Score
13 records- 0194US6998704B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2003·Granted Feb 14, 2006·86 cites·56 claims
- 0285US8525323B2Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2009·Granted Sep 3, 2013·12 cites·21 claims
- 0385US8411450B2Electronic device package, module, and electronic deviceYAMAZAKI TAKAO·Filed 2007·Granted Apr 2, 2013·14 cites·26 claims
- 0476US7795585B2Vacuum package and manufacturing process thereofNEC CORP·Filed 2008·Granted Sep 14, 2010·7 cites·10 claims
- 0575US7812440B2Electronic package device, module, and electronic apparatusNEC CORP·Filed 2007·Granted Oct 12, 2010·9 cites·19 claims
- 0675US7230328B2Semiconductor package and laminated semiconductor packageNEC CORP·Filed 2003·Granted Jun 12, 2007·22 cites·9 claims
- 0750US2013234295A1Semiconductor device and method of manufacturing same, wiring board and method of manufacturing same, semiconductor package, and electronic deviceNEC CORP·Filed 2013·Application pending·0 cites
- 0849US7594644B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2005·Granted Sep 29, 2009·0 cites·19 claims
- 0949US2013291380A1Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 1046US2011304029A1Semiconductor device and manufacturing method thereof, wiring board and manufacturing method thereof, semiconductor package, and electronic apparatusSOGAWA YOSHIMICHI·Filed 2011·Application pending·0 cites
- 1145US2008001288A1Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic ApparatusSOGAWA YOSHIMICHI·Filed 2005·Application pending·0 cites
- 1245US2008224271A1Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic DeviceNEC CORP·Filed 2005·Application pending·0 cites
- 1343US2009174052A1Electronic component, semiconductor package, and electronic deviceNEC CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →