Inventor · disambiguated record
Younghoon Sohn
Also filed as: SOHN YOUNGHOON
16 granted patents·19 pending applications·5 citations·filing 2013–2025
85Inventor score
Top patents by PatentIndex Score
35 records- 0175US2024385220A1Test apparatus and test method thereofRYU SUNGYOON·Filed 2024·Application pending·0 cites
- 0275US2025341540A1Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0371US12474260B2Terahertz signal measuring apparatus and measuring methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0470US9267903B2Methods and apparatuses for inspecting semiconductor devices using electron beamsPARK MIRA·Filed 2013·Granted Feb 23, 2016·4 cites·24 claims
- 0569US12385946B2Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·8 claims
- 0668US12092656B2Test apparatus and test method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 0768US11004712B2Method of inspecting semiconductor wafer, inspection system for performing the same, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 0865US2025224326A1Spectroscopic ellipsometer and substrate analysis method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0963US12110938B2Vibration isolation table for semiconductor equipment and vibration isolation table system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·19 claims
- 1062US12332164B2Dual resolution spectrometer, and spectrometric measurement apparatus and method using the spectrometerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·19 claims
- 1162US2025147096A1Substrate inspection apparatus and method of inspecting a substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1261US2025003734A1Material measurement system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1360US2025123243A1Semiconductor substrate inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US2025216348A1X-ray photoelectron spectroscopy apparatus and method for calculating concentration of specific element in object under inspection using x-ray photoelectron spectroscopySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US12436122B2Apparatus and method for measuring a layer of a semiconductor device using x-ray diffractionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·15 claims
- 1657US2024255274A1Complex sensing device and sensing method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1755US2024332093A1Critical dimension prediction system and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1853US2024248051A1Wafer measurement apparatus and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1952US12362138B2Method of operating scanning electron microscope (SEM) and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 2052US2024255439A1Defect detection device and defect detection methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2151US11486834B2Substrate inspection method and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 2250US12332186B2Method and system for inspecting semiconductor wafer and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2350US2025167051A1Electronic device for predicting characteristic of semiconductor device and operating method of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2449US2018096903A1Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 2549US2023366853A1Semiconductor device testing apparatus and methods of testing and fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2648US9892980B2Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 13, 2018·0 cites·16 claims
- 2748US2023384212A1Inspection method and method of manufacturing semiconductor memory device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2846US2021140899A1Substrate inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2946US2025372433A1Wafer transfer device and wafer transfer systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3045US2020182783A1Measuring apparatus and substrate analysis method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3143US10460436B2Inspection method, inspection system, and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 3241US10482593B2Inspection method, inspection system, and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·0 cites·20 claims
- 3341US2020194294A1Spectroscopic system, optical inspection method, and semiconductor device fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3438US10720365B2Method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 21, 2020·0 cites·20 claims
- 3536US10088297B2Apparatus and method for measuring thicknessSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →