Inventor · disambiguated record
Young Ho Sohn
Also filed as: SOHN YOUNG HO
14 granted patents·14 pending applications·189 citations·filing 2003–2020
92Inventor score
Files withSAMSUNG ELECTRO MECH14SOHN YOUNG HO4LG ELECTRONICS INC3DONGBU ELECTRONICS CO LTD1JO EUN JUNG1
Top patents by PatentIndex Score
28 records- 0189USD719113SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 9, 2014·43 cites·1 claims
- 0288USD717256SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·43 cites·1 claims
- 0385US11200575B2Drive-thru based order processing method and apparatusLG ELECTRONICS INC·Filed 2019·Granted Dec 14, 2021·11 cites·18 claims
- 0485USD719926SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 23, 2014·33 cites·1 claims
- 0583USD703625SPower semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 29, 2014·29 cites·1 claims
- 0682US8897011B2Heat dissipation system for power moduleKWAK YOUNG HOON·Filed 2012·Granted Nov 25, 2014·7 cites·18 claims
- 0777US9153514B2Power module packageSOHN YOUNG HO·Filed 2012·Granted Oct 6, 2015·5 cites·15 claims
- 0873US8629538B2Power module packageLEE YOUNG KI·Filed 2011·Granted Jan 14, 2014·3 cites·4 claims
- 0972US9318828B2Contact pin and power module package having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 19, 2016·3 cites·12 claims
- 1072US9030823B2Heat dissipation system for power moduleKIM KWANG SOO·Filed 2012·Granted May 12, 2015·3 cites·10 claims
- 1169US8630090B2Heat dissipation device for power conversion moduleSOHN YOUNG HO·Filed 2011·Granted Jan 14, 2014·2 cites·3 claims
- 1261US8810014B2Semiconductor package including conductive member disposed between the heat dissipation member and the lead frameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 19, 2014·1 cites·11 claims
- 1355US11482039B2Anti-spoofing method and apparatus for biometric recognitionLG ELECTRONICS INC·Filed 2020·Granted Oct 25, 2022·0 cites·19 claims
- 1454US6903455B2Side braze packagesDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Jun 7, 2005·6 cites·7 claims
- 1553US2010294543A1Heat dissipating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2009·Application pending·0 cites
- 1652US2012273116A1Heat disspiating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2012·Application pending·0 cites
- 1750US2011088928A1Heat dissipating substrateLIM CHANG HYUN·Filed 2009·Application pending·0 cites
- 1848US2011042699A1Substrate for light emitting diode package and light emitting diode package having the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1943US2014160691A1Semiconductor module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2042US2015163913A1Nested module package, and method for manufacturing sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2142US2021104021A1Method and apparatus for processing image noiseLG ELECTRONICS INC·Filed 2020·Application pending·0 cites
- 2242US2014117524A1Power semiconductor module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2341US2013001759A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2441US2014000839A1Cooling apparatusSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2541US2014001611A1Semiconductor packageJO EUN JUNG·Filed 2012·Application pending·0 cites
- 2641US2013105956A1Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2740US2014014313A1Multi-stage heat sink, cooling system with the same and method for controlling the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2840US2012121361A1Loose preventing assemblyLEE KWAN HO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →